Effects of electromigration on IMC evolution in Pb-free solder joints

Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809) Pub Date : 2004-04-27 DOI:10.1109/BEPRL.2004.1308148

Wang Lei, Wu Feng-shun, Z. Jinsong, An Bing, Wu Yiping

{"title":"Effects of electromigration on IMC evolution in Pb-free solder joints","authors":"Wang Lei, Wu Feng-shun, Z. Jinsong, An Bing, Wu Yiping","doi":"10.1109/BEPRL.2004.1308148","DOIUrl":null,"url":null,"abstract":"In order to improve electronics reliability, it is essential to study electromigration (EM) in Pb-free solder joints. There are some phenomena of the EM in the solder, such as void formation and propagation, pileup or \"hillocks\" formation and intermetallic compounds (IMCs) morphology variation. In this paper, two groups of experiments are performed to investigate the effects of EM on IMC evolution in lead-free solder joints. One is a thermal aging experiment and the other is an EM experiment. In the thermal aging experiment, the IMC on the side of the substrate is thicker than that on the chip because the solder near the substrate suffers one more reflow cycle than that near the anode. In the EM experiment, under the influence of EM, IMC at the anode is thicker than it is at the cathode. In addition, IMC will dissolve and reform in the solder, and migrate from the cathode to the anode. Finally, IMCs at the anode and cathode are both thicker than those in the thermal aging experiment.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/BEPRL.2004.1308148","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

In order to improve electronics reliability, it is essential to study electromigration (EM) in Pb-free solder joints. There are some phenomena of the EM in the solder, such as void formation and propagation, pileup or "hillocks" formation and intermetallic compounds (IMCs) morphology variation. In this paper, two groups of experiments are performed to investigate the effects of EM on IMC evolution in lead-free solder joints. One is a thermal aging experiment and the other is an EM experiment. In the thermal aging experiment, the IMC on the side of the substrate is thicker than that on the chip because the solder near the substrate suffers one more reflow cycle than that near the anode. In the EM experiment, under the influence of EM, IMC at the anode is thicker than it is at the cathode. In addition, IMC will dissolve and reform in the solder, and migrate from the cathode to the anode. Finally, IMCs at the anode and cathode are both thicker than those in the thermal aging experiment.

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电迁移对无铅焊点IMC演化的影响

为了提高电子器件的可靠性，研究无铅焊点的电迁移是十分必要的。焊料中存在空洞的形成和扩展、堆积或“山丘”的形成以及金属间化合物(IMCs)形态的变化等现象。本文通过两组实验研究了电磁对无铅焊点内积层厚度演变的影响。一个是热老化实验，另一个是电磁实验。在热老化实验中，由于衬底附近的焊料比阳极附近的焊料多经历一次回流循环，衬底侧的IMC比芯片上的IMC厚。在电磁实验中，在电磁影响下，阳极处的IMC比阴极处的厚。此外，IMC会在焊料中溶解和重组，并从阴极迁移到阳极。阳极和阴极的imc均较热老化时厚。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)

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