Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308157
H. Qi, S. Ganesan, M. Osterman, M. Pecht
To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace applications, accelerated tests were conducted to non-underfilled and underfilled packages under multiple environmental loadings at board level. This paper discusses the test results and the underfill effect on solder joint reliability. Failure modes and sites were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGAs under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.
{"title":"Accelerated testing and finite element analysis of PBGA under multiple environmental loadings","authors":"H. Qi, S. Ganesan, M. Osterman, M. Pecht","doi":"10.1109/BEPRL.2004.1308157","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308157","url":null,"abstract":"To investigate the long term reliability of plastic ball grid array (PBGA) packages in aerospace applications, accelerated tests were conducted to non-underfilled and underfilled packages under multiple environmental loadings at board level. This paper discusses the test results and the underfill effect on solder joint reliability. Failure modes and sites were identified through failure analysis on test samples. To better understand the thermomechanical behavior of PBGAs under cyclic thermal loading environments, three dimensional FEA models for non-underfilled and underfilled packages were also developed and used to predict the time to failure.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129752837","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308148
Wang Lei, Wu Feng-shun, Z. Jinsong, An Bing, Wu Yiping
In order to improve electronics reliability, it is essential to study electromigration (EM) in Pb-free solder joints. There are some phenomena of the EM in the solder, such as void formation and propagation, pileup or "hillocks" formation and intermetallic compounds (IMCs) morphology variation. In this paper, two groups of experiments are performed to investigate the effects of EM on IMC evolution in lead-free solder joints. One is a thermal aging experiment and the other is an EM experiment. In the thermal aging experiment, the IMC on the side of the substrate is thicker than that on the chip because the solder near the substrate suffers one more reflow cycle than that near the anode. In the EM experiment, under the influence of EM, IMC at the anode is thicker than it is at the cathode. In addition, IMC will dissolve and reform in the solder, and migrate from the cathode to the anode. Finally, IMCs at the anode and cathode are both thicker than those in the thermal aging experiment.
{"title":"Effects of electromigration on IMC evolution in Pb-free solder joints","authors":"Wang Lei, Wu Feng-shun, Z. Jinsong, An Bing, Wu Yiping","doi":"10.1109/BEPRL.2004.1308148","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308148","url":null,"abstract":"In order to improve electronics reliability, it is essential to study electromigration (EM) in Pb-free solder joints. There are some phenomena of the EM in the solder, such as void formation and propagation, pileup or \"hillocks\" formation and intermetallic compounds (IMCs) morphology variation. In this paper, two groups of experiments are performed to investigate the effects of EM on IMC evolution in lead-free solder joints. One is a thermal aging experiment and the other is an EM experiment. In the thermal aging experiment, the IMC on the side of the substrate is thicker than that on the chip because the solder near the substrate suffers one more reflow cycle than that near the anode. In the EM experiment, under the influence of EM, IMC at the anode is thicker than it is at the cathode. In addition, IMC will dissolve and reform in the solder, and migrate from the cathode to the anode. Finally, IMCs at the anode and cathode are both thicker than those in the thermal aging experiment.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132015340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308156
An Bing, Zheng Zonglin, Wu Feng-shun, Lu Jun, Z. Xiaodong, Wu Yiping
A dynamic model for evaluating the reflow characteristics of solder pastes is developed. The model is based on a solder paste - solder ball test (IPC-TM-650 2.4.43). The process of this test can be divided into four sequent stages: solvent effusion and volatilization, solder paste pattern shrinkage, solder ball shrinkage, and stabilization. Another bubbling stage is separated alone, because it occurs erratically. All these stages are associated with defects and their possible reasons are described and discussed. It is found that the shrinking behavior and bubbling process are two key points in the reflow process. Fast and stable shrinking, and exhaustive escaping of bubbles, are helpful to reduce the reflow defects.
{"title":"Analysis of dynamic behavior of solder reflow by solder ball test","authors":"An Bing, Zheng Zonglin, Wu Feng-shun, Lu Jun, Z. Xiaodong, Wu Yiping","doi":"10.1109/BEPRL.2004.1308156","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308156","url":null,"abstract":"A dynamic model for evaluating the reflow characteristics of solder pastes is developed. The model is based on a solder paste - solder ball test (IPC-TM-650 2.4.43). The process of this test can be divided into four sequent stages: solvent effusion and volatilization, solder paste pattern shrinkage, solder ball shrinkage, and stabilization. Another bubbling stage is separated alone, because it occurs erratically. All these stages are associated with defects and their possible reasons are described and discussed. It is found that the shrinking behavior and bubbling process are two key points in the reflow process. Fast and stable shrinking, and exhaustive escaping of bubbles, are helpful to reduce the reflow defects.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129239006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308166
D.K. Lau
The Theory of Inventive Problem Solving (TRIZ), first developed by a Russian engineer in late 1940's, is a combination of concepts and tools that has been applied by many of the top 500 companies in the United States and Europe. It is a proven algorithmic approach to solve system problems and provides a systematic approach for "innovation". The application of TRIZ in the engineering and scientific community in solving manufacturing problems and helping to create new product design has been vigorously studied and applied since it was introduced in United States a few years ago. TRIZ has been applied successfully to a wide range of industries from bio-medical to engineering and management. It is now taking shape in Asia Pacific with Korea and Japan taking the lead. Companies like Samsung and LG have been applying TRIZ for a few years and has achieved significant results in cost saving and new product development. China is fast becoming the manufacturing hub of the world with major efforts put into new product design for reliability and development. This paper discusses the role of TRIZ in driving for systematic innovation process. Discussion on the status, implementation and future development of TRIZ in China is presented.
{"title":"The role of TRIZ as an inventive tool in technology development and integration in China","authors":"D.K. Lau","doi":"10.1109/BEPRL.2004.1308166","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308166","url":null,"abstract":"The Theory of Inventive Problem Solving (TRIZ), first developed by a Russian engineer in late 1940's, is a combination of concepts and tools that has been applied by many of the top 500 companies in the United States and Europe. It is a proven algorithmic approach to solve system problems and provides a systematic approach for \"innovation\". The application of TRIZ in the engineering and scientific community in solving manufacturing problems and helping to create new product design has been vigorously studied and applied since it was introduced in United States a few years ago. TRIZ has been applied successfully to a wide range of industries from bio-medical to engineering and management. It is now taking shape in Asia Pacific with Korea and Japan taking the lead. Companies like Samsung and LG have been applying TRIZ for a few years and has achieved significant results in cost saving and new product development. China is fast becoming the manufacturing hub of the world with major efforts put into new product design for reliability and development. This paper discusses the role of TRIZ in driving for systematic innovation process. Discussion on the status, implementation and future development of TRIZ in China is presented.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"235 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123039877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308162
K.K. Lee, K. T. Ng, C. Tan, Y. Chan, L.M. Cheng
High demand for green electronics products has driven the use of conductive adhesive as a substitute for using conventional solders. Recently developed UV curable anisotropic conductive adhesive (ACA) is suggested for use in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart cards using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding and post curing. By varying the UV curing and post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier transform infrared spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. In addition, a shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of smart cards under different curing conditions were also cross-sectioned and examined using SEM (scanning electron microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.
{"title":"Fabrication of smart card using UV curable anisotropic conductive adhesive (ACA.) part I: optimization of the curing conditions","authors":"K.K. Lee, K. T. Ng, C. Tan, Y. Chan, L.M. Cheng","doi":"10.1109/BEPRL.2004.1308162","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308162","url":null,"abstract":"High demand for green electronics products has driven the use of conductive adhesive as a substitute for using conventional solders. Recently developed UV curable anisotropic conductive adhesive (ACA) is suggested for use in temperature sensitive electronic packages. The aim of this study is to optimize the bonding conditions for fabrication of smart cards using UV curable ACA. A simple designed copper coil plated on a PET was used as the micro strip antenna of the smart card. The entire fabrication process is divided into three parts, high power UV curing, chip-on-flex (COF) bonding and post curing. By varying the UV curing and post-curing parameters, a number of contactless smart cards were made. Chemical analysis using FTIR (Fourier transform infrared spectroscopy) was carried out to determine the curing degree of the UV curable ACA under different curing conditions. In order to quantify the performance of the smart card, the read range between the card reader and the sample was measured. In addition, a shear test was performed; the shear force that is required to break the ACA joint and its failure mode was recorded and discussed. ACA joints of smart cards under different curing conditions were also cross-sectioned and examined using SEM (scanning electron microscope). By comparing the results in curing degree, shear strength of the ACA joint and the reading distance of the smart card samples, a set of parameters which gave better performance of the COF bonding were determined.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"184 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115650530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308144
Wenbiao Zhao, A. Mettas, Xiaolong Zhao, P. Vassiliou, E. Elsayed
In this paper we develop a general accelerated life model for step stress testing, and present a general likelihood function formulation of step stress models. This model is easy to extend the reliability analysis to multiple-stress and profiled testing data, and reduces to Nelson's cumulative damage model, Gouno (2001)'s model, Xiong and Milliken (2002)'s model as special cases. Algorithms for fitting and testing such models are described and illustrated. The proposed model is applicable on any life distribution as long as the stress level only alters the scale parameter of the distribution. The practical use of the proposed statistical inference is demonstrated by a case study.
{"title":"Generalized step stress accelerated life model [LED case study]","authors":"Wenbiao Zhao, A. Mettas, Xiaolong Zhao, P. Vassiliou, E. Elsayed","doi":"10.1109/BEPRL.2004.1308144","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308144","url":null,"abstract":"In this paper we develop a general accelerated life model for step stress testing, and present a general likelihood function formulation of step stress models. This model is easy to extend the reliability analysis to multiple-stress and profiled testing data, and reduces to Nelson's cumulative damage model, Gouno (2001)'s model, Xiong and Milliken (2002)'s model as special cases. Algorithms for fitting and testing such models are described and illustrated. The proposed model is applicable on any life distribution as long as the stress level only alters the scale parameter of the distribution. The practical use of the proposed statistical inference is demonstrated by a case study.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129850115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308167
Zhang Fan, Z. Hongbin
In watermarking schemes an image is considered as a communication channel for transmitting messages. But because of the requirements of watermarking robustness and visibility, watermarking schemes have different characteristics from traditional communication. Watermarking capacity should be associated with the content of an image. A different image has a different watermarking capacity. In this paper, we present a content adaptive watermarking algorithm to embed the strongest watermark while maintaining the watermark's invisibility, and discuss watermarking capacity for this scenario. We also derive the relation between watermarking capacity and detection bit error rate (BER) for the first time.
{"title":"Capacity and reliability of digital watermarking","authors":"Zhang Fan, Z. Hongbin","doi":"10.1109/BEPRL.2004.1308167","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308167","url":null,"abstract":"In watermarking schemes an image is considered as a communication channel for transmitting messages. But because of the requirements of watermarking robustness and visibility, watermarking schemes have different characteristics from traditional communication. Watermarking capacity should be associated with the content of an image. A different image has a different watermarking capacity. In this paper, we present a content adaptive watermarking algorithm to embed the strongest watermark while maintaining the watermark's invisibility, and discuss watermarking capacity for this scenario. We also derive the relation between watermarking capacity and detection bit error rate (BER) for the first time.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132430321","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308150
A. Gallo
The high temperature reliability of automotive power devices, using Au wires, seems to be strongly dependent on the rate of degradation of the Au/Al wire bond interface. Although other types of wires are available (e.g. Al and Cu), Au wires appear to be preferred for the near future. Resistance measurements show that the choice of the proper molding compound is essential in achieving good high temperature results. Green molding compounds based on transition metal oxides as flame retardants have shown the best results. The goal of 20,000 hrs at 200/spl deg/C and high current seems to be achievable through the combination of the use of the green molding compound (transition metal oxides) and the metallic barrier pad design.
{"title":"Green molding compounds for high temperature automotive applications","authors":"A. Gallo","doi":"10.1109/BEPRL.2004.1308150","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308150","url":null,"abstract":"The high temperature reliability of automotive power devices, using Au wires, seems to be strongly dependent on the rate of degradation of the Au/Al wire bond interface. Although other types of wires are available (e.g. Al and Cu), Au wires appear to be preferred for the near future. Resistance measurements show that the choice of the proper molding compound is essential in achieving good high temperature results. Green molding compounds based on transition metal oxides as flame retardants have shown the best results. The goal of 20,000 hrs at 200/spl deg/C and high current seems to be achievable through the combination of the use of the green molding compound (transition metal oxides) and the metallic barrier pad design.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116873894","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308169
Z. Cheng
The effects of underfill on thermomechanical behaviors of two types (B and D) of flip chip packages, with different bumping size and stand-off height were investigated under thermal cycling by both experiments and finite element simulation. The results show that the use of underfill encapsulant increases tremendously (/spl sim/20 times) the thermal fatigue lifetime of SnPb solder joint, and weakens the effects of stand-off height on the reliability, and changes the deformation mode of the package. It was found that the thermal fatigue crack occurs in the region with a maximum plastic strain range, and the Coffin-Manson type equation could then be used for both packages with and without underfill. The effects of material models of underfill, i.e. constant elasticity (EC) and temperature dependent elasticity (ET) as well as the viscoelasticity (VE), on the thermomechanical behaviors of flip chip package were also studied in the simulation. The VE model gives comparatively large plastic strain range, and big displacements in shear direction, as well as sequentially low lifetime of solder joints. The ET model gives the close results to VE model and could be used instead of VE in simulations for the purpose of simplicity. Underfill delamination analysis of flip chip on low-cost board is also presented. The delamination propagation rates at the interface between chip and underfill have been measured by using C-SAM inspection of flip chip assemblies under thermal cycle loading. The experimental measurement was done in four cases, that were type B with fine solder joint and fractured solder joint, and type D with fine and fractured solder joint. In the finite element simulations the strain energy release rates G and the phase angles /spl phi/ near the delamination crack tip were calculated for four measurement cases by employing the fracture mechanical method. The Paris half-empirical equations were determined from the delamination propagation rates measured and the energy release rates simulated. Meanwhile, the energy release rates G with a different delamination crack length were also simulated. The G /spl sim/ a curve representing a convex shape when the crack propagates and indicates that the delamination crack may be stable. After propagating for a certain length the crack will be arrested in the flip chip assembly.
{"title":"Lifetime of solder joint and delamination in flip chip assemblies","authors":"Z. Cheng","doi":"10.1109/BEPRL.2004.1308169","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308169","url":null,"abstract":"The effects of underfill on thermomechanical behaviors of two types (B and D) of flip chip packages, with different bumping size and stand-off height were investigated under thermal cycling by both experiments and finite element simulation. The results show that the use of underfill encapsulant increases tremendously (/spl sim/20 times) the thermal fatigue lifetime of SnPb solder joint, and weakens the effects of stand-off height on the reliability, and changes the deformation mode of the package. It was found that the thermal fatigue crack occurs in the region with a maximum plastic strain range, and the Coffin-Manson type equation could then be used for both packages with and without underfill. The effects of material models of underfill, i.e. constant elasticity (EC) and temperature dependent elasticity (ET) as well as the viscoelasticity (VE), on the thermomechanical behaviors of flip chip package were also studied in the simulation. The VE model gives comparatively large plastic strain range, and big displacements in shear direction, as well as sequentially low lifetime of solder joints. The ET model gives the close results to VE model and could be used instead of VE in simulations for the purpose of simplicity. Underfill delamination analysis of flip chip on low-cost board is also presented. The delamination propagation rates at the interface between chip and underfill have been measured by using C-SAM inspection of flip chip assemblies under thermal cycle loading. The experimental measurement was done in four cases, that were type B with fine solder joint and fractured solder joint, and type D with fine and fractured solder joint. In the finite element simulations the strain energy release rates G and the phase angles /spl phi/ near the delamination crack tip were calculated for four measurement cases by employing the fracture mechanical method. The Paris half-empirical equations were determined from the delamination propagation rates measured and the energy release rates simulated. Meanwhile, the energy release rates G with a different delamination crack length were also simulated. The G /spl sim/ a curve representing a convex shape when the crack propagates and indicates that the delamination crack may be stable. After propagating for a certain length the crack will be arrested in the flip chip assembly.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"75 2-3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132268031","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2004-04-27DOI: 10.1109/BEPRL.2004.1308142
Z. Yan-zheng, Fu Zhuang, Y. Qinghua, C. Qixin, Chen Mingbo, Zhang Jun, J. Lee
The solar cell is widely used for space power. The characteristic of anti-irradiation is one of the important differences between ordinary solar cells and space solar cells. In order to ensure a space solar cell works reliably in the space environment, it is necessary to bond the anti-irradiation cover-glass to the space solar cell active surface using a kind of adhesive, and it is vital to have a reasonable coating thickness. Combining robotics and adhesive-coating technology, this paper gives an automatic bonding system for space solar cells, which can precisely control the coating thickness and realize bonding automation in non-vacuum conditions. Moreover, on the basis of the theory of non-Newtonian fluids, the paper presents a model for this system and deduces the formula for the coating thickness of space solar cells. Experiments have been performed to validate this model.
{"title":"Study on quality control in the bonding processing of space solar cell","authors":"Z. Yan-zheng, Fu Zhuang, Y. Qinghua, C. Qixin, Chen Mingbo, Zhang Jun, J. Lee","doi":"10.1109/BEPRL.2004.1308142","DOIUrl":"https://doi.org/10.1109/BEPRL.2004.1308142","url":null,"abstract":"The solar cell is widely used for space power. The characteristic of anti-irradiation is one of the important differences between ordinary solar cells and space solar cells. In order to ensure a space solar cell works reliably in the space environment, it is necessary to bond the anti-irradiation cover-glass to the space solar cell active surface using a kind of adhesive, and it is vital to have a reasonable coating thickness. Combining robotics and adhesive-coating technology, this paper gives an automatic bonding system for space solar cells, which can precisely control the coating thickness and realize bonding automation in non-vacuum conditions. Moreover, on the basis of the theory of non-Newtonian fluids, the paper presents a model for this system and deduces the formula for the coating thickness of space solar cells. Experiments have been performed to validate this model.","PeriodicalId":186676,"journal":{"name":"Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-04-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134595361","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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