Measurement results of delay degradation due to power supply noise well correlated with full-chip simulation

Y. Ogasahara, Takashi Enami, M. Hashimoto, Takashi Sato, T. Onoye
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引用次数: 4

Abstract

Power integrity is an crucial design issue in nanometer technologies because of lowered supply voltage and current increase. This paper focuses on gate delay variation due to power/ground noise, and demonstrates measurement results in a 90nm technology. For full-chip simulation, a current model with capacitance and variable resistor is developed to accurately model current dependency on voltage drop. Measurement results are well correlated with simulation, and verify that gate delay depends on average voltage drop
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电源噪声引起的时延退化的测量结果与全芯片仿真结果具有良好的相关性
由于电源电压的降低和电流的增大,电源完整性是纳米技术设计中的一个关键问题。本文重点研究了功率/地噪声引起的门延迟变化,并展示了在90nm技术下的测量结果。在全芯片仿真中,建立了带电容和可变电阻的电流模型,以准确地模拟电流对压降的依赖关系。测量结果与仿真结果吻合较好,验证了栅极延迟与平均压降的关系
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