{"title":"Thermal stability of various ball-limited-metal systems under solder bumps","authors":"K. Mizuishi, T. Mori","doi":"10.1109/ITHERM.1988.28679","DOIUrl":null,"url":null,"abstract":"Thermal stability is discussed of ball-limited-metal (BLM) layers formed under controlled-collapse solder (lead-5 wt.% tin) bumps for flip-chip interconnections. All BLM systems used here consist of a triple-layer deposit of Cr or Ti as an adhesive; Ni, Mo, Pd, or Pt as a barrier; and Au as a surface metal. Using test chips with these BLM systems, mechanical pull-strength values of solder-bump joints are obtained. These values are associated with thermal phenomena at the interface between the BLM and solder layers. The chips with Ti adhesive layers show generally superior solder-joint strength to those with Cr layers, independently of the barrier metal used. This is due to the presence of a joint fracture mode closely related to the kind of adhesive metal. Among the BLM systems examined, Ti/Ni/Au is found to provide the most reliable solder joints. This is successfully utilized as a BLM system for GaAs devices.<<ETX>>","PeriodicalId":226424,"journal":{"name":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"InterSociety Conference on Thermal Phenomena in the Fabrication and Operation of Electronic Components. I-THERM '88","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.1988.28679","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12
Abstract
Thermal stability is discussed of ball-limited-metal (BLM) layers formed under controlled-collapse solder (lead-5 wt.% tin) bumps for flip-chip interconnections. All BLM systems used here consist of a triple-layer deposit of Cr or Ti as an adhesive; Ni, Mo, Pd, or Pt as a barrier; and Au as a surface metal. Using test chips with these BLM systems, mechanical pull-strength values of solder-bump joints are obtained. These values are associated with thermal phenomena at the interface between the BLM and solder layers. The chips with Ti adhesive layers show generally superior solder-joint strength to those with Cr layers, independently of the barrier metal used. This is due to the presence of a joint fracture mode closely related to the kind of adhesive metal. Among the BLM systems examined, Ti/Ni/Au is found to provide the most reliable solder joints. This is successfully utilized as a BLM system for GaAs devices.<>
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