Microvia technique for PCB manufacturing - a technique meeting the requirement of high interconnect density

Abstract

The microvia, based on nonmechanical drilling techniques, has been introduced to the PCB market during the last few years. The available techniques provide reduced via dimensions and land sizes that give increased packaging density and improved routing possibilities for high density packages. The method of building the boards is based on a thin dielectric and sequential board build-up. In comparison with conventional PCB techniques, the number of process steps is reduced. This fact in combination with increased packaging density affects the environmental influence positively. Compatibility with conventional FR4 processing is in general good. The availability of this technique is set to increase in the market, and it has great potential for cost-effectiveness in comparison with conventional techniques.