An enhanced passivation layer for secure consumer integrated circuit devices

Abstract

Consumer electronics devices have a common point called integrated circuit (IC). Among the most advanced integrated circuits are the microprocessors which control everything from computers and cellular phones to the USB. In this paper, a novel manufacturing technique to enhance the passivation layer which protects the ICs is presented where a stronger passivation layer is made from Ni-TiO2 composite coating and Tetraethyl orthosilicate compound (TEOS/O2). The Ni-TiO2 will provide a high wear resistance and improve the hardness while the Tetraethyl orthosilicate will protect the microprocessor against ultraviolet attack on the ICs passivation layer.