Reliability of lead free solder joint by using chip size package

Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190) Pub Date : 2001-05-07 DOI:10.1109/ISEE.2001.924541

T. Hirano, K. Fukuda, K. Ito, T. Kiga, Y. Taniguchi

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引用次数: 12

Abstract

In the past few years, many studies have been reported on reliability of lead-free solder joint. Almost all of them have described evaluation of solder alloy composition of printed wiring board surface-finish. What seems to be lacking, however, is the influence of component placing condition to reliability and reliability under several stress conditions. The purpose of this work is to investigate the influence of the factor on reliability of the solder joint. We used chip size package as a test piece, which is a more popular semiconductor package, and thermal fatigue test and mechanical fatigue test were carried out. We choose experimental conditions as follow, solder materials (Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Zn-Bi, Sn-Pb), chip size package placing condition (on one side, on both sides), printed wiring board surface finish (organic solderability protector on Cu, Au plating). We got the result that chip size package placing condition, printed wiring board surface finish had more effect on reliability of the lead-free solder joint than solder materials. It is clear that placing condition and printed wiring board surface-finish greatly affects reliability of thermal fatigue and mechanical fatigue, respectively. In conclusion, the influence of the factor on reliability of lead-free solder joint was investigated from several points of view. The work helps us to clarify the influence of the factor on reliability of lead-free solder joint and lead to the guidelines for introduction of lead-free solder.

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采用芯片尺寸封装的无铅焊点可靠性

在过去的几年中，对无铅焊点的可靠性进行了大量的研究。它们几乎都描述了印制板表面光洁度中焊料合金成分的评价。然而，似乎缺乏的是部件放置条件对可靠性和几种应力条件下可靠性的影响。本工作的目的是研究各种因素对焊点可靠性的影响。我们采用芯片尺寸的封装作为试样，这是一种比较流行的半导体封装，并进行了热疲劳测试和机械疲劳测试。我们选择的实验条件如下:焊料材料(Sn-Ag-Cu、Sn-Ag-Cu- bi、Sn-Zn-Bi、Sn-Pb)、芯片尺寸封装放置条件(单面、双面)、印制板表面光洁度(镀Cu、镀Au的有机可焊性保护器)。结果表明:芯片尺寸、封装放置条件、印制板表面光洁度对无铅焊点可靠性的影响大于焊点材料。显然，放置条件和印制板表面光洁度分别对热疲劳和机械疲劳的可靠性有很大影响。最后，从多个角度对影响无铅焊点可靠性的因素进行了研究。本文的研究有助于阐明各种因素对无铅焊点可靠性的影响，并为无铅焊点的引入提供指导。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190)

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