A. quad 2.7 Gb/s parallel optical transceiver

J. Ahadian, M. Englekirk, M. Wong, T. Li, R. Hagan, R. Pommer, C. Kuznia
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引用次数: 8

Abstract

The realization of short-reach parallel optical interconnects based on multi-mode fiber ribbons requires the coalescence of vertical-cavity surface-emitting lasers, photodetectors, transmit and receiver circuitry, and an optical power control system within a compact assembly. This paper describes a solution based on silicon-on-sapphire IC technology and demonstrates an optical transceiver featuring four transmitters and four receivers, each operating at up to 2.7 Gb/s. Flip-chip bonding is used to attach four-element laser and photodetector die to the IC. Optical signals propagate through the transparent sapphire substrate. Lateral photodiodes implemented in the IC process are used to monitor the optical output power, and embedded controllers have been developed to regulate this power on a per-channel basis. Key circuit designs are presented, following a summary of the optoelectronic chip-scale packaging technology.
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A.四路2.7 Gb/s并行光模块
基于多模光纤带的短距离平行光互连的实现需要将垂直腔面发射激光器、光电探测器、发射和接收电路以及光功率控制系统合并在一个紧凑的组件内。本文介绍了一种基于蓝宝石上硅集成电路技术的解决方案,并演示了一种具有四个发送器和四个接收器的光收发器,每个光收发器的工作速度高达2.7 Gb/s。采用倒装键接技术将四元激光器和光电探测器芯片连接到集成电路上,光信号通过透明蓝宝石衬底传播。在集成电路过程中实现的横向光电二极管用于监测光输出功率,并且嵌入式控制器已开发用于在每个通道的基础上调节该功率。在总结了光电芯片级封装技术的基础上,给出了关键电路设计。
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