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2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers最新文献

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Accurate modeling of lossy silicon substrate for on-chip inductors and transformers design 片上电感和变压器设计中损耗硅衬底的精确建模
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320699
X. Huo, K.J. Chen, H. Luong, P. Chan
A physical based lumped element model is developed for lossy silicon substrates, considering both electric loss and eddy current loss induced by the substrate. A simplified ladder structure is used to accurately model the skin effect of the high conductivity silicon substrate. Good agreement with a full wave solver is obtained for inductors on different resistivity silicon substrates.
考虑硅衬底的电损耗和涡流损耗,建立了损耗硅衬底的物理集总元模型。采用简化的阶梯结构精确地模拟了高导电性硅衬底的趋肤效应。对于不同电阻率硅衬底上的电感,与全波解算器的结果一致。
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引用次数: 4
A high-efficiency miniaturized SiGe Ku-band balanced frequency doubler 一种高效小型化SiGe ku波段平衡倍频器
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320576
Juo-Jung Hung, T. Hancock, Gabriel M. Rebeiz
A monolithic SiGe balanced frequency doubler has been designed and measured for Ku-band application. The circuit operates with a 2 V supply voltage and consumes only 28 mW of DC power when the doubler is biased close to class B operation, with an input power of 1.5 dBm. An output power of 5-6 dBm is obtained from 15.4-18 GHz and the fundamental suppression is better than 25 dB. It has a high power added efficiency (PAE) of 9.2% and occupies only 700/spl times/350 /spl mu/m/sup 2/ of chip area.
设计并测量了一种适用于ku波段的单片SiGe平衡倍频器。该电路工作在2v电源电压下,当倍频器偏置接近B类工作时,输入功率为1.5 dBm,仅消耗28 mW直流功率。在15.4-18 GHz频段可获得5-6 dBm的输出功率,基波抑制效果优于25 dB。它具有9.2%的高功率附加效率(PAE),芯片面积仅为700/spl倍/350 /spl μ /m/sup / 2/。
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引用次数: 12
An optimum design of the micromachined RF inductor 微机械射频电感器的优化设计
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320702
Jr-Wei Lin, C.C. Chen, J.K. Huang, Y. Cheng
With a complete performance investigation of the on-chip micromachined inductor with mechanical disturbances using ANSYS and HFSS simulators, an optimum structural design of the micromachined spiral inductors with fully CMOS compatible post-processes for RFIC applications is proposed in this paper. Via the incorporation of a sandwich dielectric membrane (0.7 /spl mu/m SiO/sub 2// 0.7 /spl mu/m Si/sub 3/N/sub 4// 0.7 /spl mu/m TEOS) to enhance the structural rigidity, the inductor can have better signal stability. As compared, the new design of a 5nH micromachined inductor can have less than 45% inductance variation than the conventional one while both devices operate at 8GHz but with 10 m/sec/sup 2/ acceleration. Meanwhile, using a cross shape instead of blanket membrane can also effectively eliminate the inductance variation induced by the working temperature change (20/spl deg/C to 75/spl deg/C). It's our belief that the new micromachined inductors can have not only high Q performance but also better signal stability suitable for wide range RFIC applications.
本文利用ANSYS和HFSS仿真软件对具有机械扰动的片上微机械电感进行了全面的性能研究,提出了一种完全兼容CMOS后处理的RFIC应用微机械螺旋电感的优化结构设计。通过加入夹层介质膜(0.7 /spl mu/m SiO/sub 2// 0.7 /spl mu/m Si/sub 3/N/sub 4// 0.7 /spl mu/m TEOS)来增强结构刚度,使电感具有更好的信号稳定性。相比之下,新设计的5nH微机械电感比传统电感的电感变化小于45%,而两种器件都工作在8GHz,但速度为10 m/sec/sup /加速度。同时,采用十字形膜代替毯状膜也能有效消除工作温度变化(20/spl℃~ 75/spl℃)引起的电感变化。我们相信,新型微机械电感不仅具有高Q性能,而且具有更好的信号稳定性,适合大范围RFIC应用。
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引用次数: 2
A novel prescaler for silicon bipolar multi-Gigahertz applications 一种用于硅双极多千兆赫应用的新型预分频器
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320691
T. Copani, S. Smerzi, G. Palmisano
High-speed prescalers are critical blocks when designing circuits for multi-GHz applications as well as for new optical-fiber networks. In this paper, an enhancement technique is shown for Si-bipolar E/sup 2/CL dividers. The proposed circuit allows high-speed operation despite a low supply voltage while it avoids using emitter followers which could lead to dangerous unwanted oscillations. A divide-by-8 prescaler was fabricated in a 46-GHz-f/sub T/ Si-bipolar technology to work within a 10-GHz output frequency PLL. Measurements show the circuit works reliably up to 12 GHz and can still operate at 11 GHz with a supply voltage as low as 2.7 V.
高速预分频器是设计多ghz应用电路和新型光纤网络的关键模块。本文介绍了一种硅双极E/sup /CL分频器的增强技术。所提出的电路允许高速运行,尽管低电源电压,同时避免使用发射极跟随器,这可能导致危险的不必要的振荡。采用46-GHz-f/sub - T/ si双极技术制作了一个除8预分频器,工作在10ghz输出频率的锁相环内。测量表明,该电路可以可靠地工作到12ghz,并且在电源电压低至2.7 V的情况下仍然可以工作在11ghz。
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引用次数: 6
Distributed MOS varactor biasing for VCO gain equalization in 0.13 /spl mu/m CMOS technology 0.13 /spl mu/m CMOS技术中用于压控振荡器增益均衡的分布式MOS变容偏置
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320548
Julien Mira, Thierry Divel, Serge Ramet, Jean-Baptiste, Deval, STMicroelectronics
The paper describes work done on a LC-VCO to linearize its frequency-voltage (Kvco) characteristic in order to extend its versatility. The technology used is a standard 0.13 /spl mu/m CMOS supplied by 1.2 V. The optimization is made on the varactor stage of the resonator and gives a nearly constant Kvco (140/spl plusmn/10 MHz/V from 2.36 GHz to 2.44 GHz), in spite of the MOS varactor non-linear characteristic, with still a good pushing (9 MHz/V) and constant phase noise (-126 dBc/Hz at 3 MHz offset).
本文介绍了对LC-VCO进行频率-电压(Kvco)特性线性化以扩展其通用性的工作。所使用的技术是由1.2 V供电的标准0.13 /spl mu/m CMOS。对谐振器的变容管级进行了优化,在2.36 GHz至2.44 GHz范围内,尽管MOS变容管具有非线性特性,但仍具有几乎恒定的Kvco (140/spl plusmn/10 MHz/V),并且仍然具有良好的推力(9 MHz/V)和恒定的相位噪声(在3 MHz偏移时为-126 dBc/Hz)。
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引用次数: 65
A 900 MHz GSM PA in 250 nm CMOS with breakdown voltage protection and programmable conduction angle 900兆赫GSM PA在250纳米CMOS击穿电压保护和可编程的传导角
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320624
K. Choi, D. Allstot, V. Krishnamurthy
A three-stage 900 MHz GSM power amplifier implemented in 2 mm/sup 2/ in 250 nm CMOS outputs 2 W and 1-5 W with 30 and 43% drain and power-added efficiencies with 3.0 and 2.5 V power supply voltages, respectively. A cross-coupled self-biased cascode configuration reduces maximum voltage stress in the class-E driver stage to 1.6 V/sub DD/ without the use of additional bias voltages. A programmable conduction angle technique is also introduced and demonstrated.
一种采用2mm /sup / 250nm CMOS实现的三级900mhz GSM功率放大器,在3.0 V和2.5 V电源电压下,输出功率分别为2w和1- 5w,漏极和功率增加效率分别为30%和43%。交叉耦合的自偏置级联码配置将e类驱动级的最大电压应力降低到1.6 V/sub DD/,而无需使用额外的偏置电压。介绍并演示了一种可编程导通角技术。
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引用次数: 5
A broadband SiGe mixer for 5-GHz WLAN applications with X-band quadrature generation and high image-rejection 一种宽带SiGe混频器,用于5 ghz无线局域网应用,具有x波段正交生成和高图像抑制
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320673
F. Gruson, G. Gaborit, P. Abele, H. Schumacher
We report on the realization of an image-reject receiver that covers the various WLAN bands in Europe, Japan and the US, fabricated using a low-cost, 0.8 /spl mu/m production-line SiGe-HBT process. A modified Gilbert mixer with a common-base input stage allows for a broadband RF operation from 2.5-6 GHz at a low supply voltage of 3 V. Broadband quadrature generation was achieved by using a fully integrated X-band VCO at 10 GHz in conjunction with a master-slave divider rather than using a polyphase filter or a quadrature VCO. While consuming less chip-area than competing solutions, we achieve an excellent image suppression of 40-45 dB without any post-tuning.
我们报告了一种图像抑制接收器的实现,该接收器覆盖了欧洲,日本和美国的各种WLAN频段,采用低成本,0.8 /spl mu/m生产线SiGe-HBT工艺制造。改进的吉尔伯特混频器具有共基输入级,可在3 V的低电源电压下实现2.5-6 GHz的宽带RF操作。宽带正交生成是通过使用10 GHz的完全集成的x波段VCO与主从分频器结合实现的,而不是使用多相滤波器或正交VCO。虽然比竞争解决方案消耗更少的芯片面积,但我们实现了40-45 dB的出色图像抑制,而无需任何后调。
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引用次数: 3
Multiple-GHz ring and LC VCOs in 0.18 /spl mu/m CMOS 0.18 /spl mu/m CMOS中的多ghz环形和LC压控振荡器
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320658
Y. A. Eken, J. Uyemura
This work presents a comparison of the ring and LC VCOs to be used in multiple-GHz communication systems. Multiple-GHz CMOS ring and LC VCOs are implemented on the same chip and tested under similar conditions for a fair comparison. The prototype chip was fabricated using a 0.18 /spl mu/m CMOS process and includes three-stage ring and symmetrical LC VCOs aimed for this comparison. The ring VCO dissipates 50 mW at an oscillation frequency of 6.1 GHz, and exhibits -97.5 dBc/Hz phase noise (@ 1 MHz). The LC VCO has a maximum frequency of 3 GHz with a 46% tuning range and has -111.4dBc/Hz phase noise (@1 MHz) while using 3.6 mW.
本文介绍了用于多ghz通信系统的环形和LC压控振荡器的比较。在相同的芯片上实现了多ghz CMOS环和LC压控振荡器,并在相似的条件下进行了测试,以进行公平的比较。原型芯片采用0.18 /spl μ m CMOS工艺制造,包括三级环形和对称LC压控振荡器,旨在进行比较。环形VCO在6.1 GHz的振荡频率下耗散50 mW,并显示-97.5 dBc/Hz的相位噪声(@ 1 MHz)。LC压控振荡器的最大频率为3ghz,调谐范围为46%,使用3.6 mW时相位噪声为-111.4dBc/Hz (@ 1mhz)。
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引用次数: 13
90 nm CMOS MMIC amplifier 90纳米CMOS MMIC放大器
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320570
M. A. Masud, H. Zirath, M. Ferndahl, H. Vickes
Small signal amplifiers at 20 and 40 GHz, based on a 90 nm CMOS process are demonstrated. A gain of 5.8 dB at 20 GHz for single stage has been obtained with a 1 dB compression point at 1 dBm. The corresponding figures for the 40 GHz amplifiers are 6 dB and -5.75 dBm. Noise figure for the 20 GHz amplifier is 6.4 dB. Both single gate access and double gate access transistors have been used in the design. DC power consumption of the 20 GHz single stage amplifier was found to be 10 mW whereas for the 40 GHz double stage amplifier it is approximately 19 mW. Total circuit area is 0.7/spl times/0.8 mm/sup 2/ for the single stage and 1/spl times/0.7 mm/sup 2/ for the 40 GHz double stage amplifier.
基于90纳米CMOS工艺,展示了20 GHz和40 GHz的小信号放大器。在20 GHz单级增益为5.8 dB,压缩点为1 dB。40ghz放大器对应的数字为6db和-5.75 dBm。20 GHz放大器的噪声系数为6.4 dB。设计中采用了单栅极和双栅极两种晶体管。20 GHz单级放大器的直流功耗为10 mW,而40 GHz双级放大器的直流功耗约为19 mW。对于单级放大器,总电路面积为0.7/spl倍/0.8 mm/sup 2/;对于40 GHz双级放大器,总电路面积为1/spl倍/0.7 mm/sup 2/。
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引用次数: 78
Metal-mask configurable RF front-end circuits 金属掩模可配置射频前端电路
Pub Date : 2004-06-06 DOI: 10.1109/RFIC.2004.1320679
Yang Xu, C. Boone, L. Pileggi
This paper describes metal-mask configurable RF circuits that offer reduced design and manufacturing risk, hence lowering nonrecurring engineering (NRE) costs. The base circuit fabric is configured for various wireless applications using only top metal and via layers. A two-stage design optimization methodology is used to optimally trade-off area and performance for design risk and cost. Measurement results are shown for a metal-mask configurable RF front-end circuit fabric that is configured for applications in 1.5 GHz GPS, 2.1 GHz WCDMA and 5 GHz WLAN using a 0.25 /spl mu/m 47 GHz f/sub T/ SiGe BiCMOS process. The final three metal and via layers are the application-specific physical design differences for the three front-end circuits. The three frontend designs consume 10.5 mA, 9.5 mA, and 8.5 mA from 2.5 V, provide noise figures of 2.5 dB, 2.8 dB and 4.5 dB, have conversion gains of 24.6 dB, 24.2 dB and 12 dB, and offer IIP3s of -8dBm, -9dBm and 4dBm, respectively.
本文介绍了金属掩模可配置射频电路,降低了设计和制造风险,从而降低了非重复性工程(NRE)成本。基本电路结构配置为仅使用顶部金属和通孔层的各种无线应用。采用两阶段设计优化方法对设计风险和成本进行面积和性能的优化权衡。测量结果显示了金属掩模可配置射频前端电路结构,该电路结构配置用于1.5 GHz GPS, 2.1 GHz WCDMA和5 GHz WLAN,使用0.25 /spl mu/m 47 GHz f/sub T/ SiGe BiCMOS工艺。最后三个金属层和通孔层是三个前端电路的特定应用物理设计差异。这三种前端设计的功耗分别为10.5 mA、9.5 mA和8.5 mA,噪声系数分别为2.5 dB、2.8 dB和4.5 dB,转换增益分别为24.6 dB、24.2 dB和12 dB, IIP3s分别为-8dBm、-9dBm和4dBm。
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引用次数: 3
期刊
2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers
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