Affordable high performance InP X-band transceiver module for large aperture phased array applications

J.M. Yang, M. Aust, Y. Chung, W. Lee, R. Stokes, R. Dupery, R. Lai, B. Gorospe, R. Kagiwada
{"title":"Affordable high performance InP X-band transceiver module for large aperture phased array applications","authors":"J.M. Yang, M. Aust, Y. Chung, W. Lee, R. Stokes, R. Dupery, R. Lai, B. Gorospe, R. Kagiwada","doi":"10.1109/MWSYM.2004.1338938","DOIUrl":null,"url":null,"abstract":"The objective of this paper is to provide an implementation to construct an affordable and high performance transceiver module which can meet the stringent performance specification required for a large aperture phased array. An InP based transceiver chip set consisting of a HBT power amplifier with >60% PAE and a HEMT LNA consuming < 3mW of DC power is assembled in a low cost BGA package to achieve the performance and cost goal of the module.","PeriodicalId":334675,"journal":{"name":"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2004.1338938","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The objective of this paper is to provide an implementation to construct an affordable and high performance transceiver module which can meet the stringent performance specification required for a large aperture phased array. An InP based transceiver chip set consisting of a HBT power amplifier with >60% PAE and a HEMT LNA consuming < 3mW of DC power is assembled in a low cost BGA package to achieve the performance and cost goal of the module.
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经济实惠的高性能InP x波段收发模块,用于大孔径相控阵应用
本文的目标是提供一个实现来构建一个经济实惠的高性能收发模块,该模块可以满足大孔径相控阵所要求的严格性能规范。在低成本的BGA封装中,组装了一个PAE >60%的HBT功率放大器和一个直流功率< 3mW的HEMT LNA,实现了基于InP的收发器芯片组的性能和成本目标。
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