{"title":"Combining cooling technology and facility design to improve HPC data center energy efficiency","authors":"L. Parnell, D. Demetriou, Eric Y. Zhang","doi":"10.1109/ITHERM.2016.7517579","DOIUrl":null,"url":null,"abstract":"As the science and engineering demand for high performance computing (HPC) grows beyond leading edge research institutions and communities to encompass routine activities of many disciplines, computing center infrastructures expand in their size, density and power demands. Long-practiced HPC center enhancements are increasingly demanding cooling methods that extend well beyond the capabilities of implementations that have become the staple of facility designs, even beyond those of the now-dominant architecture - commodity-processor-based, air-cooled rack clusters. As compute capacity aggressively increases in HPC centers, the power and cooling requirements, and thus cost of operation of the facilities, continues to rise correspondingly. This growth increasingly taxes the abilities of the hosting organizations to accommodate these demands. To address the challenge of meeting such pervasive demands, this paper examines energy efficiency in existing data centers from a two-pronged approach: employing direct water cooling and optimizing the facility infrastructure with as little capital investment to the building as possible.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517579","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
As the science and engineering demand for high performance computing (HPC) grows beyond leading edge research institutions and communities to encompass routine activities of many disciplines, computing center infrastructures expand in their size, density and power demands. Long-practiced HPC center enhancements are increasingly demanding cooling methods that extend well beyond the capabilities of implementations that have become the staple of facility designs, even beyond those of the now-dominant architecture - commodity-processor-based, air-cooled rack clusters. As compute capacity aggressively increases in HPC centers, the power and cooling requirements, and thus cost of operation of the facilities, continues to rise correspondingly. This growth increasingly taxes the abilities of the hosting organizations to accommodate these demands. To address the challenge of meeting such pervasive demands, this paper examines energy efficiency in existing data centers from a two-pronged approach: employing direct water cooling and optimizing the facility infrastructure with as little capital investment to the building as possible.