Heat-resistant Au-ZrB/sub x/-n-SiC 6H Schottky barriers

N. S. Boltovets, V. N. Ivanov, O.E. Rengevych
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Abstract

We present the results of our research into morphological and electrical properties of ZrB/sub x/-n-SiC 6H and Au-ZrB/sub x/-n-SiC 6H surface-barrier structures. They were studied both before and after a 90 s rapid thermal annealing (RTA) in vacuum at the temperature T=1000/spl deg/C. The ZrB/sub x/ films were obtained using magnetron sputtering from pressed targets of stoichiometric composition. It was shown that the RTA changed neither contact layered structure nor the abrupt character of the interface, and the contact barrier properties were retained. For the initial (pre-RTA) samples the Schottky barrier height /spl phi//sub B/ was 0.69-0.78 eV; post-RTA, it became 0.59-0.70 eV.
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耐热Au-ZrB/sub - x/-n-SiC 6H肖特基势垒
我们介绍了ZrB/sub x/-n-SiC 6H和Au-ZrB/sub x/-n-SiC 6H表面势垒结构的形态学和电学性质的研究结果。在温度为1000/spl℃的真空条件下进行90 s快速热退火(RTA)前后的研究。采用磁控溅射法制备了ZrB/ subx /薄膜。结果表明,RTA既没有改变接触层状结构,也没有改变界面的突变特征,并保持了接触势垒特性。对于初始(rta前)样品,肖特基势垒高度/spl phi//sub B/为0.69-0.78 eV;rta后变为0.59-0.70 eV。
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