Quality improvement and cost reduction using statistical outlier methods

2009 IEEE International Conference on Computer Design Pub Date : 2009-10-04 DOI:10.1109/ICCD.2009.5413175

A. Nahar, K. Butler, J. Carulli, Charles Weinberger

引用次数: 33

Abstract

Quality improvement and cost reduction in the overall IC manufacturing and test processes are being continuously sought. Outlier screening methods can address both of these needs. As technology scales, it has become increasingly difficult to screen outliers without excessive Type I or II errors. Hundreds of parameters are collected at wafer probe, but there lacks a systematic way of selecting outlier screens. In this paper we describe a statistical approach to both identify outliers and select beneficial screening parameters more effectively. Results on a 90nm design to reduce the burn-in fails are described.

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使用统计离群值方法提高质量和降低成本

在整个集成电路制造和测试过程中不断寻求质量改进和成本降低。异常值筛选方法可以满足这两种需求。随着技术的发展，在没有过多的I型或II型错误的情况下筛选异常值变得越来越困难。在晶圆探针上收集了数百个参数，但缺乏系统的选择异常屏幕的方法。在本文中，我们描述了一种统计方法，既能识别异常值，又能更有效地选择有益的筛选参数。描述了减少老化失效的90nm设计的结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2009 IEEE International Conference on Computer Design

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