Experimental modeling of the thermal resistance of the heat sink dedicated to SMD LEDs passive cooling

Abstract

Thermal management of light emitting diodes (LEDs) lighting fixtures is a fundamental issue that can significantly affect the performance and life time of installed lighting products. Based on an experimental study, this paper outlines the vital role of passive heat dissipation in thermal management of low-power LED packaging. The aim of this present work is to give an appropriate model to evaluate the thermal resistance of the heat sink. For optimizing the heat sink dissipation, it is necessary to reduce its thermal resistance as same as improve its cooling capacity because the thermal resistance plays a major role in the total resistance of LED package. In addition, the experimental measurements associated to the LEDs' illuminances and temperatures are made using advanced equipment such as digital luxmeter, and IR camera, respectively, which the results are analyzed by Raycam reporting System software in real time.