Analysis of MEMS devices under temperature stress test

Abstract

The current technological process has mainly interested in integrating MEMS devices in most technological devices to offer complete control and awareness about a particular process or system. Such devices, which in most cases include gyroscope, accelerometer, and magnetometer, are fully integrated on a single chip and have a cost not higher than few dollars. Recently they have been more employed in embedded systems devoted to the autonomous driving operation for terrestrial and aeronautical vehicles. Such devices are often deployed to the market with datasheet reporting their characteristic without highlighting their behavior under particular environmental conditions. Most MEMS devices are mounted in a very harsh environment, characterized by high-temperature excursion and vibration from different sources. The authors propose a temperature stress test for such devices and evaluate their behavior under static conditions. Experimental results will evidence the accelerometer and gyroscope MEMS sensors' dependence on the temperature in a range of −10°C to 50°C.