Power integrity challenges of re-designing a mobile SoC with fully integrated voltage regulator to IoT applications

Y. F. Shen
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引用次数: 2

Abstract

The demand for connected smart cars has grown exponentially in the past few years. To meet consumer's digital lifestyle needs and take part in this emerging market, microprocessor companies, such as Intel®, are shifting a focus to automotive SoC package designs. This paper examines the differences in design specifications between automotive and mobile and the implications to Power Integrity. The automotive use case, temperature cycling, and reliability qualifications are more stringent and add to the Power Integrity challenges. Frequency and time domain simulations were performed for all Fully Integrated Voltage Regulator (FIVR) and non-FIVR rails and compared between automotive vs. mobile.
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为物联网应用重新设计具有完全集成稳压器的移动SoC的电源完整性挑战
在过去几年中,对联网智能汽车的需求呈指数级增长。为了满足消费者的数字生活方式需求并参与这一新兴市场,英特尔®等微处理器公司正在将重点转向汽车SoC封装设计。本文考察了汽车和移动设备之间设计规范的差异及其对电源完整性的影响。汽车用例、温度循环和可靠性要求更加严格,这也增加了电源完整性的挑战。对所有全集成电压调节器(FIVR)和非FIVR导轨进行了频率和时域模拟,并对汽车和移动设备进行了比较。
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