{"title":"Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management","authors":"Zhang Kai, M. Yuen, D. Xiao, Y. Fu, P. Chan","doi":"10.1109/ECTC.2008.4550200","DOIUrl":null,"url":null,"abstract":"Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substrates by thermal chemical vapor deposition (CVD). Iron nitrate (Fe(NO3)3ldr9H2O) was used as the catalyst. Parameters influencing CNT synthesis were studied and optimized. Several surface treatment methods were proposed to improve the quality of CNTs synthesized on aluminum alloy substrates. The grown CNT arrays were used as thermal interface material (TIM) while the aluminum alloy substrate used as the heat sink in high brightness LED packages. The measured thermal resistance of the grown CNT-TIM was 38 mm2-K/W. The output light power testing demonstrated CNT-TIM is an attractive thermal management solution for HB- LED packages.","PeriodicalId":378788,"journal":{"name":"2008 58th Electronic Components and Technology Conference","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"14","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 58th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2008.4550200","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 14
Abstract
Vertically aligned carbon nanotube (VACNT) arrays were synthesized directly on aluminum alloy substrates by thermal chemical vapor deposition (CVD). Iron nitrate (Fe(NO3)3ldr9H2O) was used as the catalyst. Parameters influencing CNT synthesis were studied and optimized. Several surface treatment methods were proposed to improve the quality of CNTs synthesized on aluminum alloy substrates. The grown CNT arrays were used as thermal interface material (TIM) while the aluminum alloy substrate used as the heat sink in high brightness LED packages. The measured thermal resistance of the grown CNT-TIM was 38 mm2-K/W. The output light power testing demonstrated CNT-TIM is an attractive thermal management solution for HB- LED packages.
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