Mixed-Signal Switching Noise Analysis Using Voronoi-Tessellated Substrate Macromodels

Andrew T. Yang Ivan L. Wemple
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引用次数: 1

Abstract

We present a new modeling technique for analyzing the impact of substrate-coupled switching noise in CMOS mixed-signal circuits. Lumped element RC substrate macromodels are efficiently generated from layout using Voronoi tessellation. The models retain the accuracy of previously proposed models, but contain orders of magnitude fewer circuit nodes, and are suitable for analyzing large-scale circuits. The modeling strategy has been verified using detailed device simulation, and applied to some mixed-A/D circuit examples.
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基于voronoi - tesselated衬底宏模型的混合信号开关噪声分析
我们提出了一种新的建模技术来分析基片耦合开关噪声对CMOS混合信号电路的影响。集总单元RC基板宏模型是利用Voronoi镶嵌有效地从布局中生成的。该模型保留了先前提出的模型的精度,但包含的电路节点数量减少了几个数量级,适合于分析大规模电路。通过详细的器件仿真验证了该建模策略,并将其应用于一些混合a /D电路实例。
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