Daoming Xi, Y. Zou, Xiao-hui Ma, Yang Li, Zibin Yang, Li Xu, Wei Zhao, Qingxue Sui, Zhimin Zhang
{"title":"Study on heat sink and solder of C-Mount packaged semiconductor laser","authors":"Daoming Xi, Y. Zou, Xiao-hui Ma, Yang Li, Zibin Yang, Li Xu, Wei Zhao, Qingxue Sui, Zhimin Zhang","doi":"10.1109/ICOOM.2012.6316218","DOIUrl":null,"url":null,"abstract":"The selection of semiconductor laser package materials including heat sink and solder has an important impact to the cooling and life of the laser, and thus performing related studies is very important. A C-Mount package semiconductor laser model was established in this paper, and thermal characteristic of different kinds of heat sink materials was simulated by the finite element software ANSYS. The temperature distribution of semiconductor laser was subsequently simulated. Then Cu was selected as heat sink, and In or AuSn was used as a solder, and the thermal stress distribution and thermal deformation of different solder materials were analyzed. The distribution of thermal stress of the semiconductor laser has also been investigated.","PeriodicalId":129625,"journal":{"name":"2012 International Conference on Optoelectronics and Microelectronics","volume":"95 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Conference on Optoelectronics and Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICOOM.2012.6316218","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The selection of semiconductor laser package materials including heat sink and solder has an important impact to the cooling and life of the laser, and thus performing related studies is very important. A C-Mount package semiconductor laser model was established in this paper, and thermal characteristic of different kinds of heat sink materials was simulated by the finite element software ANSYS. The temperature distribution of semiconductor laser was subsequently simulated. Then Cu was selected as heat sink, and In or AuSn was used as a solder, and the thermal stress distribution and thermal deformation of different solder materials were analyzed. The distribution of thermal stress of the semiconductor laser has also been investigated.
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