High performance circuits in 0.18 /spl mu/m SiGe BiCMOS process for wireless applications

P. Ye, B. Agarwal, M. Reddy, L. Li, J. Cheng, P. Mudge, E. McCarthy, S. Lloyd
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引用次数: 7

Abstract

Silicon germanium bipolar CMOS (SiGe BiCMOS) process technology is gaining increasing popularity for RF circuits in wireless applications due to high performance, low cost, high yield and higher levels of integration with mixed signal and digital CMOS circuits. Four test circuits were designed and fabricated in Conexant's 0.18 /spl mu/m SiGe BiCMOS process to evaluate the performance benefits provided by this state of the art process technology. The RF performance achieved in this process clearly makes this a process of choice for future RFIC products.
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高性能电路采用0.18 /spl mu/m SiGe BiCMOS工艺,用于无线应用
硅锗双极CMOS (SiGe BiCMOS)工艺技术由于其高性能、低成本、高产量以及与混合信号和数字CMOS电路的更高集成度,在无线应用中的射频电路中越来越受欢迎。在Conexant的0.18 /spl mu/m SiGe BiCMOS工艺中设计和制造了四个测试电路,以评估这种最先进工艺技术提供的性能优势。在此过程中实现的射频性能显然使其成为未来RFIC产品的选择。
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