MEMS thermoelectric microcooler

Abstract

We report prototype thermoelectric microcoolers (/spl mu/-TEC) based on transport along thin- and thick-film planes using MEMS technology. The paper describes the fabrication processes as well as an analytic model used to design the microdevices. Si/Ge superlattice thin films grown by MBE and electrochemically deposited Bi/sub 2/Te/sub 3/ films are used as the thermoelectric materials in the fabrication of the /spl mu/-TEC. To reduce the heat leakage, the substrates are removed under the active region such that the cooling spots are suspended only by the thermoelectric legs. Additional heat leakage through the supporting structure and thermal radiation are considered through modeling.