A compact C-band down converter SiP with integrated LO in a metal ceramic package

Abstract

This paper presents the design and development of a compact C-band down converter realized in a 12mm×12mm surface mount metal ceramic package. The size reduction has been achieved by development of compact sized MMIC components required for the receiver, viz., a double balanced mixer, a voltage controlled oscillator with on-chip varactor and RF and IF amplifiers. All the MMICs have been designed and fabricated using indigenously developed 0.7μm GaAs MESFET (G7A) technology at GAETEC. The receiver works in a frequency range of 5.0-6.0 GHz and produces down converted signal in 500-1500 MHz band when beaten with internal LO of the receiver, operated at 4.5 GHz. The conversion gain of the receiver is 27dB with a noise figure of 5dB. The RF-IF and LO-IF isolation of better than 25dB is achieved though EM optimized placement of MMICs and isolation barriers inside the package.