Technical Feasibility of a New Solventless Approach to Manufacture Pre-Pregs and Laminates for Electronic Applications

L. Dehnke, Ranjeet R. Hogade, J. Castro
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Abstract

This study refers to the technical feasibility of a continuous process for manufacturing pre-pregs and copper-clad laminates for electronic applications, with the aim to overcome three critical technological challenges, the elimination of environmentally detrimental solvents, elimination of voids and elimination of cure/temperature history variability between laminates. The new approach is based on the concept of injection pultrusion or continuous RTM. The centerpiece of the process is the impregnation die. Glass fabric and resin are fed into the die where impregnation and depending of the design, partial reaction occurs. The B-staging, if not finished in the die, will be done in an oven located immediately after. The final cure and lamination occurs in a continuous belt clamp. In the present paper, we discuss the chemo-rheology of a potential resin system and use it to establish the technical feasibility of the process.
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一种制造电子用预浸料和层压板的无溶剂新方法的技术可行性
本研究涉及到制造用于电子应用的预浸料和覆铜层压板的连续工艺的技术可行性,旨在克服三个关键的技术挑战,即消除对环境有害的溶剂,消除空隙和消除层压板之间的固化/温度历史变化。新方法是基于注射拉挤或连续RTM的概念。该工艺的核心是浸渍模具。玻璃织物和树脂被送入模具,在那里浸渍,根据设计,部分反应发生。b阶段,如果没有在模具中完成,将立即在烤箱中完成。最后的固化和层压发生在一个连续的皮带夹。在本文中,我们讨论了一个潜在的树脂体系的化学流变性,并利用它来确定该工艺的技术可行性。
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