Wafer scale integration (WSI) of programmable gate arrays (PGA's)

J. F. Mcdonald, S. Dabral, R. Philhower, M.E. Russinovich
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引用次数: 1

Abstract

Wafer scale integration of memories by row and column repair follows a well established path developed in industry for the repair of large DRAM's. Rows and columns in these memories can be diagnosed and those found faulty can be replaced by spares. If the entire wafer of dies can be fully repaired then all the cells on the wafer may be interconnected using artwork for chip to chip wiring which is the same on all wafers. What one would like is a similar approach which could be applied to logic circuits. Traditionally, however, logic is viewed as being inherently less regular than memory. This paper addresses one approach to accomplishing WSI based on a highly regular, restructurable logic component known as Programmable Gate Array (PGA), which is also known as a Logic Component Array (LCA).<>
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可编程门阵列(PGA)的晶圆级集成(WSI)
通过行和列修复的晶圆级存储器集成遵循工业上为修复大型DRAM而开发的良好路径。这些记忆中的行和列可以被诊断出来,那些发现有缺陷的可以用备用的来代替。如果整个晶圆可以完全修复,那么晶圆上的所有单元都可以使用芯片到芯片布线的艺术品进行互连,这在所有晶圆上都是相同的。人们想要的是一种类似的方法,可以应用于逻辑电路。然而,传统上,逻辑被认为本质上不如记忆有规律。本文提出了一种基于高度规则的、可重构的逻辑组件(称为可编程门阵列(PGA),也称为逻辑组件阵列(LCA))来实现WSI的方法。
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