RF characterization of flip-chip anisotropic conductive adhesives joints

Abstract

Anisotropic conductive adhesives (ACAs) have been proved to own good performance in high frequency applications. However, the effect of distribution of conductive particles in ACAs on RF (radio frequency) characterization is not fully understood. Finite difference in time domain (FDTD) method based electromagnetic software QuickWave is used to establish the structure and investigate RF characterization of ACA. The effect of distribution of conductive particles both in random and uniform distribution is simulated. Furthermore, the influence of conductor overlap is also investigated. An equivalent lumped circuit is also set up. The results show in a certain particles number, that there is minor influence in different distribution of conductive particles, and that as expected, the conductor overlap should be minimized to improve high frequency performance