Toshikatsu Tanaka, Zengbin Wang, T. Iizuka, M. Kozako, Y. Ohki
{"title":"High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength","authors":"Toshikatsu Tanaka, Zengbin Wang, T. Iizuka, M. Kozako, Y. Ohki","doi":"10.1109/ICPES.2011.6156695","DOIUrl":null,"url":null,"abstract":"Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.","PeriodicalId":158903,"journal":{"name":"2011 International Conference on Power and Energy Systems","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 International Conference on Power and Energy Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICPES.2011.6156695","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19
Abstract
Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.