High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Toshikatsu Tanaka, Zengbin Wang, T. Iizuka, M. Kozako, Y. Ohki
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引用次数: 19

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.
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高导热环氧/BN复合材料具有足够的介电击穿强度
制备了不同类型的环氧/BN复合材料,优化了材料条件,以获得高导热性和高击穿强度。最佳复合材料为环氧树脂/团块h-BN/纳米二氧化硅纳米微复合材料,其导热系数为12 W/m•K, BD强度为15 kVpeak/0.2 mm。要获得高的两种性能值,最重要的因素之一是降低孔隙率。填料的表面处理和纳米填料的加入也是有用的。
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