B. Zhang, V. Murugesan, N. Billstrom, P. Stenquist, Johan Liu
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引用次数: 0
Abstract
Increased packaging demands in wireless communications, and military electronics has led to the use of flip-chips for RF and microwave applications. For a reliable bonding of flip-chip interconnection, proper knowledge of bonding parameters and bonding ability to different substrates is important. This paper depicts a comparative analysis of flip-chip bonding of GaAs MMIC (monolithic microwave integrated circuit) to thick/thin film metallization on ceramic substrates (hereinafter thick-film and thin-film), and organic substrates using anisotropic conductive film (ACF), thermo-compression (TC) bonding methods with different bonding parameters. The results from the optimization study of the parameter settings for mechanical reliability of ACF and TC with different substrates are presented
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