Failure analysis for Copper Wire Bonding process from machine perspective

Abstract

In fast changing and very competitive industry like semiconductor manufacturing, reliability or probability of failure always has been a crucial part in any processes and operation involving machine and equipment. One of many electronic manufacturing technologies is Wire Bond process, which entails a flexible and an accurate technology because of fast changing market demand for smaller electronic gadgets. Nature of wire bond process which is very delicate, usually makes any failures happen during this type of operation goes unnoticed for sometimes and this situation will cost the company a fortune. This paper aims to discuss equipment reliability based on failure occurrences in wire bond process using copper wire. Copper bonding has received attention because of its low cost, high electrical conductivity and resistance to wire sweep during plastic encapsulation. However, copper have hard properties thus more care is required during bonding as to avoid cratering problem. With the situation, this paper was written to find and analyze machine failure using Failure Mode and Effect Analysis (FMEA) technique to verify machine capability and problems faced when operating using Copper wire. Furthermore, general approach for improvement plan based on type of failure and failure causes are presented as conducted in a semiconductor company in Malaysia. The finding of the study provides evidence that failure analysis is an important task to be done in order to understand machine capability and reliability.