Parametric analysis of multiple interconnects via canonical reduced order modeling

Zhigang Hao, G. Shi
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Abstract

For design nodes at 65 nm and below, timing will essentially be a statistical measure of the fabricated circuit and heavily correlated with process variation. This paper proposes a novel parametric interconnect analysis using canonical reduced order modeling. Models in canonical forms have the feature of a small number of free model parameters. This property can be made use of effectively for parametric analysis via interpolation. Experimental results demonstrate the effectiveness of the proposed methodology.
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基于规范降阶建模的多互连参数分析
对于65纳米及以下的设计节点,时序本质上是制造电路的统计度量,与工艺变化密切相关。本文提出了一种基于正则降阶模型的参数化互连分析方法。规范形式的模型具有自由模型参数数量少的特点。这一性质可以有效地用于通过插值进行参数分析。实验结果证明了该方法的有效性。
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