{"title":"Flexible novel trident shaped microstrip patch antennas design employing Teflon substrate","authors":"Avneet Kaur, Aastha, P. Kalra, Ekambir Sidhu","doi":"10.1109/ICCCCM.2016.7918229","DOIUrl":null,"url":null,"abstract":"This paper exhibits the aptness of flexible Teflon material having dielectric constant £r=2.1 to be employed as substrate in the Microstrip patch antenna design. This paper presents two flexible Teflon substrates of thickness 0.5 mm and 1 mm, respectively. The antenna designs employ a Trident shaped copper patch on the top surface of dielectric Teflon substrate and a defected ground plane on the other side of substrate. In this paper, substrate and structure materials employed in the antenna designs have been retained identical, whereas the dimensions of antenna designs are distinctive. In this paper, the thickness of the substrate is varied and the effect on the bandwidth, directivity and gain of antennas are investigated. A thorough parametric analysis has been performed and it has been perceived that the gain and directivity of antenna increases by decreasing the thickness of substrate. It has been also witnessed that the resonant frequency of the designed antenna, shifts to lower frequency by employing thick dielectric substrate. The performance of Microstrip patch antenna has been compared in terms of directivity(dBi), gain(dB), return loss(dB), impedance bandwidth(GHz) and half power beam width(degrees). The antenna has been designed in CST Microwave Studio 2014 and has been fabricated and verified using E5071C Network Analyzer and anechoic chamber.","PeriodicalId":410488,"journal":{"name":"2016 International Conference on Control, Computing, Communication and Materials (ICCCCM)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 International Conference on Control, Computing, Communication and Materials (ICCCCM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCCCM.2016.7918229","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This paper exhibits the aptness of flexible Teflon material having dielectric constant £r=2.1 to be employed as substrate in the Microstrip patch antenna design. This paper presents two flexible Teflon substrates of thickness 0.5 mm and 1 mm, respectively. The antenna designs employ a Trident shaped copper patch on the top surface of dielectric Teflon substrate and a defected ground plane on the other side of substrate. In this paper, substrate and structure materials employed in the antenna designs have been retained identical, whereas the dimensions of antenna designs are distinctive. In this paper, the thickness of the substrate is varied and the effect on the bandwidth, directivity and gain of antennas are investigated. A thorough parametric analysis has been performed and it has been perceived that the gain and directivity of antenna increases by decreasing the thickness of substrate. It has been also witnessed that the resonant frequency of the designed antenna, shifts to lower frequency by employing thick dielectric substrate. The performance of Microstrip patch antenna has been compared in terms of directivity(dBi), gain(dB), return loss(dB), impedance bandwidth(GHz) and half power beam width(degrees). The antenna has been designed in CST Microwave Studio 2014 and has been fabricated and verified using E5071C Network Analyzer and anechoic chamber.
本文论证了介电常数为r=2.1的柔性聚四氟乙烯材料作为衬底用于微带贴片天线设计的适用性。本文介绍了两种厚度分别为0.5 mm和1mm的柔性聚四氟乙烯基板。该天线设计采用在介质聚四氟乙烯基板的上表面采用三叉戟形铜片,在基板的另一侧采用有缺陷的接地面。在本文中,天线设计中使用的衬底和结构材料保持相同,而天线设计的尺寸是不同的。本文研究了衬底厚度的变化对天线带宽、指向性和增益的影响。进行了彻底的参数分析,发现减小衬底厚度会增加天线的增益和指向性。研究还发现,采用厚介质衬底后,天线的谐振频率向低频偏移。从指向性(dBi)、增益(dB)、回波损耗(dB)、阻抗带宽(GHz)和半功率波束宽度(度)等方面比较了微带贴片天线的性能。该天线在CST Microwave Studio 2014中进行了设计,并使用E5071C网络分析仪和消声室进行了制作和验证。