{"title":"Initial Wetting and Reaction Sequences in Soldering","authors":"G. Walker, P. Dehaven","doi":"10.1109/IRPS.1984.362041","DOIUrl":null,"url":null,"abstract":"The importance of soldering in the semiconductor industry continues to grow as packages become denser, with the resultant increasing number of connections between chip and substrate. During soldering, intermetallic formation at interfaces and/or in the bulk of the solder can affect physical properties of the joint. We have found that initial stages of wetting control intermetallic formation, its dispersion in the solder and the solder's wetting characteristics.","PeriodicalId":326004,"journal":{"name":"22nd International Reliability Physics Symposium","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1984-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"22nd International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1984.362041","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
The importance of soldering in the semiconductor industry continues to grow as packages become denser, with the resultant increasing number of connections between chip and substrate. During soldering, intermetallic formation at interfaces and/or in the bulk of the solder can affect physical properties of the joint. We have found that initial stages of wetting control intermetallic formation, its dispersion in the solder and the solder's wetting characteristics.
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