The crosstalk analysis of package-PCB complex interconnect structure

Abstract

Accompanied with fast development of the high-speed board/package design, for the complex interconnection structure composed of via, solder ball and printing line has become a basic unit, designer are trying to eliminate or minimize all the impedance mismatches along the high-speed signal path. This paper addresses designing for crosstalk by comparing the crosstalk of near end and far end. The crosstalk can be minimized by optimizing a few parameters such as dielectric constant, current direction and spacing. The impacts of theses parameters are investigated with the help of a full-wave electromagnetic simulation. The results clearly show that the small changes in interconnection structure can affect the impedance mismatch significantly meanwhile degrade the signal propagation performance.