Imitation chip design based on TSV 2.5D package

Abstract

With the development of microelectronics technology, the microelectronic package has been developed from traditional 2D package to 3D package which is high-density and multi-chip. Therefore 2.5D or 3D package has developed rapidly. The structure of 2.5D package is simply compared with 3Dpackage, so it is easy to apply in products in a short time. As a result, 2.5D package has become a popular way to make the package small, light and multi-functional. This paper focuses on a method to design imitation chip based on 2.5D package. Due to the structure of Virtex-7 which has been researching, it is necessary to design an imitation chip to apply in verifying the encapsulation technology of 2.5D package. This method is beneficial to shorten the design period and save the cost of production. Furthermore, it is in favor of studying 2.5D package deeply.