K. Venkataraman, V. Suresh, S. Iyengar, M. Ott, S. R. Kalari, J. Zhi, E. Ruetz, M. Gray, B. Reynov, A. Iqbal
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引用次数: 1
Abstract
The advent of broadband services requires multi service provisioning platforms (MSPP) to achieve >10Gbps capacity with 1-4 rack unit footprint, power <200W and cost <$10K. Highly integrated SoC using 0.13mu CMOS 19.3times19.3mm die packaged in a 1517 FCBGA affords a unique MSPP solution consisting of 155M-10Gbps SONET/SDH framing, low/high order path processing, grooming, cross-connection up to 22.5Gbps and an embedded processor. A rigorous methodology enabled a production-worthy SoC comprising 9Mgates/14Mbit memory
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