{"title":"Hybrid Integration Technology for High Functionality Devices in Optical Communications","authors":"G. Maxwell","doi":"10.1109/OFC.2008.4528710","DOIUrl":null,"url":null,"abstract":"This paper reviews the techniques and results for photonic hybrid integration of active semiconductor devices and passive planar waveguides. The paper shows the CIP platform scaleability in terms of cost, performance and complexity of integration.","PeriodicalId":298721,"journal":{"name":"OFC/NFOEC 2008 - 2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-05-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"29","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"OFC/NFOEC 2008 - 2008 Conference on Optical Fiber Communication/National Fiber Optic Engineers Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OFC.2008.4528710","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 29
Abstract
This paper reviews the techniques and results for photonic hybrid integration of active semiconductor devices and passive planar waveguides. The paper shows the CIP platform scaleability in terms of cost, performance and complexity of integration.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
