A non-destructive technique using 3D X-ray Computed Tomography to reveal semiconductor internal physical defects

Abstract

This paper focuses on the application of 3D X-ray Computed Tomography (CT) to precisely detect and confirm semiconductor internal physical defects without the need to decapsulate the sample. Equipped with advanced technologies and innovations, today's X-ray machine is capable of reconstructing the two-dimension (2D) sliced images to form 3D images and videos in much shorter time. With the introduction of 3D X-ray CT designed for electronics field, failure mechanisms once only visible after destructive analysis can now be revealed in non-destructive way. The technique not only saves cost, it shortens the turnaround time tremendously and allows customer's response and relevant improvement actions to be taken more efficiently.