Mobility enhanced power CMOS

Abstract

This paper introduces mobility enhanced 5V CMOS through geometry optimization in 130nm technology for state-of-the-art RSP performance. By realizing <;100> channel direction on (100) wafer with grid-type layout, mobility of both NMOS and PMOS is enhanced in addition to increased effective width. Furthermore even higher mobility is achieved through introduction of biaxial compressive stress from nearby STI islands. As a result, IDSAT and IDLIN increase by 24%/29% for NMOS and 29%/37% for PMOS respectively compared to standard bar-type layout. All of this is obtained without any process change.