Characterization of a body-tied vertical MOSFET

Abstract

In this paper, a non-classical body-tied vertical field-effect transistor (BTVFET) utilizing the self-aligned technique is presented and demonstrated. Based on the simulations, we find out that the electrical characteristics of the BTVFET are better than that of the conventional SOI VFET, including the outstanding ability of heat dissipation, higher channel mobility, lower parasitic capacitance, and reduced gate leakage current. The excellent subthreshold swing (~77 mV/dec) of the BTVFET is also attractive. In addition, the shallow junction is easy to form because the partially insulating oxide is under the drain regions in our proposed quasi-SOI vertical MOSFET. Hence, it is believed that the BTVFET can become one of the candidates for future CMOS scaling.