Opportunities to Upgrade Main Memory

D. Resnick
{"title":"Opportunities to Upgrade Main Memory","authors":"D. Resnick","doi":"10.1145/2818950.2818960","DOIUrl":null,"url":null,"abstract":"Hybrid Memory Cube (HMC), in production by Micron Technology, is a new DRAM component that has multiple advantages over current parts including higher bandwidth, lower energy, abstract and more pin efficient interface and other benefits. The memory technology can be used as a base for even further improvements, including upgrading memory scalability to multiple terabytes and terabyte per second bandwidths per processor and resilience such that even large supercomputers with 100s of petabytes of memory will have reliable memory systems. Future systems, from desktops up, will have memory systems of multiple levels, including DRAM and non-volatile (NAND?) components that are both first-level memory capabilities, along with DRAM or SRAM scratch memory such that total data motion is greatly reduced. The result can be improved system performance and reduced system power.","PeriodicalId":389462,"journal":{"name":"Proceedings of the 2015 International Symposium on Memory Systems","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-10-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2015 International Symposium on Memory Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/2818950.2818960","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Hybrid Memory Cube (HMC), in production by Micron Technology, is a new DRAM component that has multiple advantages over current parts including higher bandwidth, lower energy, abstract and more pin efficient interface and other benefits. The memory technology can be used as a base for even further improvements, including upgrading memory scalability to multiple terabytes and terabyte per second bandwidths per processor and resilience such that even large supercomputers with 100s of petabytes of memory will have reliable memory systems. Future systems, from desktops up, will have memory systems of multiple levels, including DRAM and non-volatile (NAND?) components that are both first-level memory capabilities, along with DRAM or SRAM scratch memory such that total data motion is greatly reduced. The result can be improved system performance and reduced system power.
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升级主存的机会
美光公司正在生产的混合内存立方体(HMC)是一种新型DRAM组件,与现有组件相比,具有更高的带宽、更低的能耗、抽象和更高效的引脚接口等诸多优势。内存技术可以作为进一步改进的基础,包括将内存可伸缩性升级到多个tb和每个处理器每秒tb的带宽,以及弹性,这样即使是具有100 pb内存的大型超级计算机也将拥有可靠的内存系统。未来的系统,从台式电脑开始,将拥有多级存储系统,包括DRAM和非易失性(NAND)组件,它们都是第一级存储功能,以及DRAM或SRAM刮刮存储器,这样可以大大减少总数据移动。结果可以提高系统性能,降低系统功耗。
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