R. Doyle, B. O'Flynn, W. Lawton, J. Barrett, J. Buckley
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引用次数: 1
Abstract
Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques.
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