Electrical characterization of signal routability and performance [CPGAs]

M. Mechaik
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引用次数: 3

Abstract

Electrical characterization and performance of signal routing layers is analyzed for ceramic pin grid array (CPGA) packages. Numerical values are tabulated for crosstalk, and attenuation for signal The implications of layer routability, signal width, and signal thickness are also analyzed. A table of numerical values for the differential impedance of a dual microstrip line is also obtained.
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信号可达性和性能的电气特性[CPGAs]
分析了陶瓷引脚网格阵列(CPGA)封装信号布线层的电学特性和性能。对串扰和信号衰减进行了数值计算,并对层可达性、信号宽度和信号厚度的影响进行了分析。并给出了双微带线差分阻抗的数值表。
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