A Novel Fabrication for Pressure Sensor with Polymer Material and Its Characteristic Testing

H. Ko, C.W. Liu, C. Gau
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引用次数: 2

Abstract

In the current fabrication of pressure sensor, both the sensor cavity and the sensor diaphragm were made of SU-8 which can be readily spun coat on the substrate at desired thickness and patterned by lithography. The thickness of the diaphragm, and the height of the sensor cavities, allowing deformation of diaphragm, can be readily varied from few to hundreds of microns by spin coat different thickness of SU-8 layer. This allows fabrication of cavity with much greater heights and measurement of pressure with much wider range. However, the sensor material used for the pressure sensor is the polysilicon doped with a high concentration of boron, which can readily sense the deformation of a diaphragm. This has precluded the possibility of fabricating the cavities and diaphragm first - which is a low temperature process, and then depositing the polysilicon sensor on the above - which is a high temperature process. Fabrication strategy has to be reversed, i.e., starts with the high temperature process of depositing the doped polysilicon layer and then the low temperature process.
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一种新型高分子材料压力传感器制造方法及其特性测试
在目前的压力传感器制造中,传感器腔和传感器膜片都是由SU-8制成的,SU-8可以很容易地以所需的厚度涂覆在基板上,并通过光刻进行图案化。通过自旋涂覆不同厚度的SU-8层,膜片的厚度和允许膜片变形的传感器腔的高度可以很容易地从几微米到几百微米变化。这允许制造更高高度的腔体和更宽范围的压力测量。然而,用于压力传感器的传感器材料是掺杂高浓度硼的多晶硅,它可以很容易地感知隔膜的变形。这就排除了首先制造空腔和隔膜的可能性——这是一个低温过程,然后在上面沉积多晶硅传感器——这是一个高温过程。制造策略必须反转,即从沉积掺杂多晶硅层的高温工艺开始,然后再进行低温工艺。
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