Effect of RF sputtering parameters on PZT crystal growth

Miao Yu, T. Giffney, K. Aw, Haixia Zhang
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引用次数: 2

Abstract

Lead zirconate titanate(PZT) due to its large polarization, large dielectric constant and good piezoelectric performance has become popular in a wide range of applications in MEMS field. The prevailing technique for PZT deposition is sol-gel method, but the stability of solution and repeated coating can't be precisely controlled. Sputtering technique is used in this work for its relatively simple fabrication process, uniform thickness. In this work, PZT films are sputtered on Pt/Ti/SiO2/Si substrate prior to annealing. PZT preferential orientation is highly depend on the sputtering parameters. X-ray diffraction(XRD) analysis has been performed to compare the crystal growth. TiO2 seed layer is also introduced in this work.
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射频溅射参数对PZT晶体生长的影响
锆钛酸铅(PZT)由于具有大极化、大介电常数和良好的压电性能,在MEMS领域得到了广泛的应用。溶胶-凝胶法是沉积PZT的主流技术,但溶液的稳定性和重复镀膜不能精确控制。采用溅射技术制作工艺简单,厚度均匀。在这项工作中,PZT薄膜在退火前溅射在Pt/Ti/SiO2/Si衬底上。PZT的择优取向高度依赖于溅射参数。用x射线衍射(XRD)分析了晶体的生长情况。本文还引入了TiO2种子层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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