Crosstalk study of high speed on-package interconnects for multi-chip package

Abstract

This paper presents the crosstalk analysis study for high-speed on-package interconnects in multi-chip package (MCP). The crosstalk coupling effects from adjacent aggressors on signaling performance e.g. eye opening and signal overshoot were investigated in this study. Simulations were performed on both microstrip and stripline structures from 2Gbps up-to 6Gbps. Several key design parameters e.g. package trace width and trace spacing ratio as well as the channel length were further explored to identify the dominating factor of crosstalk coupling in the high-speed on-package interconnect design. Simulation results indicated the crosstalk effects from adjacent aggressors beyond second order still have significant impacts on the signaling performance and need to be carefully considered for high-speed MCP applications. This paper also establishes several guidelines to enable optimum design trade-off between signaling performance and silicon real-estate.