Organic Semiconductors Providing New Solutions for Future Medical Implants

M. Schwarz, J. Buddefeld, V. Ortmann
{"title":"Organic Semiconductors Providing New Solutions for Future Medical Implants","authors":"M. Schwarz, J. Buddefeld, V. Ortmann","doi":"10.1109/POLYTR.2005.1596491","DOIUrl":null,"url":null,"abstract":"Although implantable medical microsystems like painkillers, deep brain stimulators and the promising cochlear implants, have reached a high degree of reliability and usability for the patient, the implementation of neural stimulators with hundreds or thousands of microelectrodes still suffers by the interconnection problem between the electrode array and the electronic stimulator device. A mechanically flexible interconnection of all electrodes of a large 2D-electrode array to a monolithically integrated stimulator/recorder device is almost impossible, since the integrated circuit can only be attached using either bumps or bonds. In this contribution, the usage of organic semiconductors for the implementation of an addressable active stimulator cell is proposed to overcome these limitations. This stimulator electronic can be fabricated either with printable long chain organic semiconductors or, as described here, with short chain semiconductors (oligomers) like pentacene. The mechanical flexibility of arbitrarily sized and shaped 2D multicontact array is completely preserved, if this flexible semiconductor electronic is interlaced between the electrode rows and columns.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2005.1596491","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Although implantable medical microsystems like painkillers, deep brain stimulators and the promising cochlear implants, have reached a high degree of reliability and usability for the patient, the implementation of neural stimulators with hundreds or thousands of microelectrodes still suffers by the interconnection problem between the electrode array and the electronic stimulator device. A mechanically flexible interconnection of all electrodes of a large 2D-electrode array to a monolithically integrated stimulator/recorder device is almost impossible, since the integrated circuit can only be attached using either bumps or bonds. In this contribution, the usage of organic semiconductors for the implementation of an addressable active stimulator cell is proposed to overcome these limitations. This stimulator electronic can be fabricated either with printable long chain organic semiconductors or, as described here, with short chain semiconductors (oligomers) like pentacene. The mechanical flexibility of arbitrarily sized and shaped 2D multicontact array is completely preserved, if this flexible semiconductor electronic is interlaced between the electrode rows and columns.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
有机半导体为未来的医疗植入物提供新的解决方案
尽管诸如止痛药、深部脑刺激器和前景光明的人工耳蜗等植入式医疗微系统已经达到了高度的可靠性和可用性,但具有数百或数千个微电极的神经刺激器的实施仍然受到电极阵列与电子刺激装置之间互连问题的困扰。将大型2d电极阵列的所有电极机械灵活地连接到单片集成刺激器/记录器设备上几乎是不可能的,因为集成电路只能使用凸起或键连接。在这一贡献,使用有机半导体的实现一个可寻址的有源刺激细胞是为了克服这些限制。这种电子刺激器既可以用可打印的长链有机半导体制造,也可以用短链半导体(低聚物)如并五苯制造。如果将这种柔性半导体电子器件穿插在电极行和列之间,则可以完全保留任意尺寸和形状的二维多接触阵列的机械灵活性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
CMP of PC, PMMA and SU-8 Polymers Numerical Approach to Characterization of Thermally Conductive Adhesives Lead-free Assembly Defects in Plastic Ball Grid Array Packages Selection criteria of press-materials and packaging conditions for power electron devices Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1