O. Amster, K. Rubin, Yongliang Yang, D. Iyer, A. Messinger, R. Crowder
{"title":"Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy","authors":"O. Amster, K. Rubin, Yongliang Yang, D. Iyer, A. Messinger, R. Crowder","doi":"10.1109/IPFA.2018.8452492","DOIUrl":null,"url":null,"abstract":"Two doped semiconductor samples are measured using probe-based Scanning Microwave Impedance Microscopy (sMIM). One is a plan-view polished CMOS image sensor and the other is a cross-section polished power device. Both samples are imaged with sMIM using two different approaches: the first using a dual pass method with dC/dV images acquired simultaneously with sMIM during the first pass in contact mode, and the second pass at a fixed offset from the surface. The second method uses a non-resonant mode where C- V are acquired at specific lateral locations. The C- V curves are used to determine polarity compared to dC/dV and also to distinguish p-n junctions, characterize doping concentration, and build images at constant DC values to discern subtle changes not evident in traditional SCM imaging.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Two doped semiconductor samples are measured using probe-based Scanning Microwave Impedance Microscopy (sMIM). One is a plan-view polished CMOS image sensor and the other is a cross-section polished power device. Both samples are imaged with sMIM using two different approaches: the first using a dual pass method with dC/dV images acquired simultaneously with sMIM during the first pass in contact mode, and the second pass at a fixed offset from the surface. The second method uses a non-resonant mode where C- V are acquired at specific lateral locations. The C- V curves are used to determine polarity compared to dC/dV and also to distinguish p-n junctions, characterize doping concentration, and build images at constant DC values to discern subtle changes not evident in traditional SCM imaging.