Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy

O. Amster, K. Rubin, Yongliang Yang, D. Iyer, A. Messinger, R. Crowder
{"title":"Nano C-V imaging of Semiconductor Devices with Scanning Microwave Impedance Microscopy","authors":"O. Amster, K. Rubin, Yongliang Yang, D. Iyer, A. Messinger, R. Crowder","doi":"10.1109/IPFA.2018.8452492","DOIUrl":null,"url":null,"abstract":"Two doped semiconductor samples are measured using probe-based Scanning Microwave Impedance Microscopy (sMIM). One is a plan-view polished CMOS image sensor and the other is a cross-section polished power device. Both samples are imaged with sMIM using two different approaches: the first using a dual pass method with dC/dV images acquired simultaneously with sMIM during the first pass in contact mode, and the second pass at a fixed offset from the surface. The second method uses a non-resonant mode where C- V are acquired at specific lateral locations. The C- V curves are used to determine polarity compared to dC/dV and also to distinguish p-n junctions, characterize doping concentration, and build images at constant DC values to discern subtle changes not evident in traditional SCM imaging.","PeriodicalId":382811,"journal":{"name":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2018.8452492","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Two doped semiconductor samples are measured using probe-based Scanning Microwave Impedance Microscopy (sMIM). One is a plan-view polished CMOS image sensor and the other is a cross-section polished power device. Both samples are imaged with sMIM using two different approaches: the first using a dual pass method with dC/dV images acquired simultaneously with sMIM during the first pass in contact mode, and the second pass at a fixed offset from the surface. The second method uses a non-resonant mode where C- V are acquired at specific lateral locations. The C- V curves are used to determine polarity compared to dC/dV and also to distinguish p-n junctions, characterize doping concentration, and build images at constant DC values to discern subtle changes not evident in traditional SCM imaging.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用扫描微波阻抗显微镜对半导体器件进行纳米C-V成像
采用探针扫描微波阻抗显微镜(sMIM)对两种掺杂半导体样品进行了测量。一种是平面视图抛光CMOS图像传感器,另一种是截面抛光功率器件。使用两种不同的方法对两个样品进行sMIM成像:第一种方法使用双通道方法,在接触模式下第一次通过sMIM同时获得dC/dV图像,第二种方法在与表面的固定偏移处进行。第二种方法使用非谐振模式,其中C- V在特定的横向位置获得。C- V曲线用于确定与dC/dV相比的极性,也用于区分p-n结,表征掺杂浓度,并在恒定dC值下构建图像,以识别传统SCM成像中不明显的细微变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Faster Localization of Logic Soft Failures Using a Combination of Scan Diagnosis at Reduced VDD and LADA Case Study and Application on Failure Analysis for Power Device Failure Analysis Techniques for 3D Packages Impact of Wire RC Based on High Voltage SCAN Failure Analysis in 10nm Process Contactless Fault Isolation of Ultra Low k Dielectrics in Soft Breakdown Condition
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1