Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder

Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. Pub Date : 2006-06-27 DOI:10.1109/HDP.2006.1707599

M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma

{"title":"Thermal conductivity of isotropic conductive adhesives composed of an epoxy-based binder","authors":"M. Inoue, H. Muta, T. Maekawa, S. Yamanaka, K. Suganuma","doi":"10.1109/HDP.2006.1707599","DOIUrl":null,"url":null,"abstract":"The thermal conductivity of a practical isotropic conductive adhesive (ICA) comprising of an epoxy-based binder containing flake-shaped and spherical Ag particles has been studied. The specimens exhibit anisotropy in their thermal conductivities. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured. Analysis using the Wiedemann-Franz rule indicates that their thermal conductivities increase with increasing contribution from electrical conduction. Curing and annealing conditions that induce a large shrinkage of the adhesive binder lead to decreased electrical resistivity and increased thermal conductivity, because the contacts between the filler particles are enhanced, therefore causing a decrease any interfacial resistances. In order to analyze the thermal conductivity of advanced conductive adhesives, a novel analytical method that includes a reasonable definition of the state of the percolation networks that are formed by the filler particles needs to be developed","PeriodicalId":406794,"journal":{"name":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","volume":"97 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-06-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HDP.2006.1707599","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

The thermal conductivity of a practical isotropic conductive adhesive (ICA) comprising of an epoxy-based binder containing flake-shaped and spherical Ag particles has been studied. The specimens exhibit anisotropy in their thermal conductivities. In addition, their thermal conductivities apparently depend on their thermal history during the curing and subsequent annealing processes, even if they are fully cured. Analysis using the Wiedemann-Franz rule indicates that their thermal conductivities increase with increasing contribution from electrical conduction. Curing and annealing conditions that induce a large shrinkage of the adhesive binder lead to decreased electrical resistivity and increased thermal conductivity, because the contacts between the filler particles are enhanced, therefore causing a decrease any interfacial resistances. In order to analyze the thermal conductivity of advanced conductive adhesives, a novel analytical method that includes a reasonable definition of the state of the percolation networks that are formed by the filler particles needs to be developed

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由环氧基粘合剂组成的各向同性导电粘合剂的导热性

研究了一种实用的各向同性导电胶粘剂(ICA)的导热性能，该胶粘剂由含有片状和球形银颗粒的环氧基粘结剂组成。试样的热导率表现出各向异性。此外，它们的导热系数显然取决于它们在固化和随后的退火过程中的热历史，即使它们完全固化。利用Wiedemann-Franz规则分析表明，它们的导热系数随导电性的增加而增加。固化和退火条件会导致粘合剂的大收缩，导致电阻率降低，导热系数增加，因为填料颗粒之间的接触增强，因此导致任何界面电阻降低。为了分析高级导电胶粘剂的导热性，需要开发一种新的分析方法，该方法包括对填料颗粒形成的渗透网络状态的合理定义

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Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06.

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