The Material Science Behind Repetitive Hammering, Solution Annealing, and Tempering on Hadfield Steel

IF 0.9 Q3 ENGINEERING, MULTIDISCIPLINARY Journal of Engineering and Technological Sciences Pub Date : 2023-10-26 DOI:10.5614/j.eng.technol.sci.2023.55.4.4
Ida Farida, Rochim Suratman
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Abstract

The Hadfield steel used in this study contained 11 to 14% Mn and 1.1 to 1.4% C. Hadfield steel that underwent heat treatment showed insignificant differences in microstructure and hardness. On the other hand, Hadfield steel that was subjected to heat treatment combined with repetitive hammering exhibited changes in microstructure, as indicated by the presence of more and denser slip lines in accordance with an increased amount of deformation. The hardness value of the Hadfield steel also significantly increased. The slip lines discovered in the Hadfield steel that underwent solution annealing and tempering followed by repetitive hammering increased in number and appeared more compact than in the Hadfield steel without tempering. Additionally, the hardness value of the Hadfield steel with tempering was higher than that of the Hadfield steel without tempering. The strain values and thickness reduction results showed that the Hadfield steel subjected to tempering had higher strain and thickness reduction than the Hadfield steel without tempering. Higher strain and thickness reduction leads to higher hardness.
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哈德菲尔德钢重复锤击、溶液退火和回火背后的材料科学
本研究使用的Hadfield钢中Mn含量为11 ~ 14%,c含量为1.1 ~ 1.4%。经过热处理的Hadfield钢的显微组织和硬度差异不显著。另一方面,经过热处理和反复锤击的哈德菲尔德钢的显微组织发生了变化,随着变形量的增加,出现了更多、更密集的滑移线。哈德菲尔德钢的硬度值也显著提高。经过固溶退火和回火后反复锤击的哈德菲尔德钢中发现的滑移线数量增加,且比未回火的哈德菲尔德钢更致密。经回火处理的哈德菲尔德钢的硬度值高于未经回火处理的哈德菲尔德钢。应变值和减薄结果表明,经回火处理的哈德菲尔德钢比未经回火处理的哈德菲尔德钢有更高的应变和减薄。更高的应变和厚度减小导致更高的硬度。
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来源期刊
Journal of Engineering and Technological Sciences
Journal of Engineering and Technological Sciences ENGINEERING, MULTIDISCIPLINARY-
CiteScore
2.30
自引率
11.10%
发文量
77
审稿时长
24 weeks
期刊介绍: Journal of Engineering and Technological Sciences welcomes full research articles in the area of Engineering Sciences from the following subject areas: Aerospace Engineering, Biotechnology, Chemical Engineering, Civil Engineering, Electrical Engineering, Engineering Physics, Environmental Engineering, Industrial Engineering, Information Engineering, Mechanical Engineering, Material Science and Engineering, Manufacturing Processes, Microelectronics, Mining Engineering, Petroleum Engineering, and other application of physical, biological, chemical and mathematical sciences in engineering. Authors are invited to submit articles that have not been published previously and are not under consideration elsewhere.
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