{"title":"Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe","authors":"Masaaki Hashimoto;Taiga Kawakami;Abdulkareem Alasli;Ryobu Nomura;Hosei Nagano;Ai Ueno","doi":"10.1109/JMEMS.2023.3318413","DOIUrl":null,"url":null,"abstract":"This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation. [2023-0140]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"32 6","pages":"519-521"},"PeriodicalIF":2.5000,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10288587","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/10288587/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling in the polymer LHP, with up to 34 °C reduction in evaporator temperature when compared to a non-fluid-charged state in a horizontal orientation. [2023-0140]
期刊介绍：
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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