Pub Date : 2024-10-02DOI: 10.1109/JMEMS.2024.3454944
{"title":"Journal of Microelectromechanical Systems Publication Information","authors":"","doi":"10.1109/JMEMS.2024.3454944","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3454944","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"C2-C2"},"PeriodicalIF":2.5,"publicationDate":"2024-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10703206","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142368335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-10-02DOI: 10.1109/JMEMS.2024.3455088
{"title":"TechRxiv: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/JMEMS.2024.3455088","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3455088","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"656-656"},"PeriodicalIF":2.5,"publicationDate":"2024-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10703205","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142368501","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-18DOI: 10.1109/jmems.2024.3455095
Roufaida Bensalem, Mohannad Y. Elsayed, Hani H. Tawfik, Mourad N. El-Gamal
{"title":"Capacitive Micromachined Transducers With Out-of-Plane Repulsive Actuation for Enhancing Ultrasound Transmission in Air","authors":"Roufaida Bensalem, Mohannad Y. Elsayed, Hani H. Tawfik, Mourad N. El-Gamal","doi":"10.1109/jmems.2024.3455095","DOIUrl":"https://doi.org/10.1109/jmems.2024.3455095","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"75 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-09-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142257829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-09-09DOI: 10.1109/jmems.2024.3450911
Tae-Soo Kim, Yong-Bok Lee, So-Young Lee, Sung-Ho Kim, Jun-Bo Yoon
{"title":"Highly Selective Etching of Silicon Dioxide Over Aluminum Using Mixtures of Sulfuric Acid and Hydrofluoric Acid","authors":"Tae-Soo Kim, Yong-Bok Lee, So-Young Lee, Sung-Ho Kim, Jun-Bo Yoon","doi":"10.1109/jmems.2024.3450911","DOIUrl":"https://doi.org/10.1109/jmems.2024.3450911","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"13 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216961","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-30DOI: 10.1109/jmems.2024.3447880
Maider Calderon-Gonzalez, David Cheyns, Rob Ameloot, Jan Genoe
{"title":"Integrated Sensors to Experimentally Measure Microheater Uniformity: Geometry Implications in Meander-Based Structures","authors":"Maider Calderon-Gonzalez, David Cheyns, Rob Ameloot, Jan Genoe","doi":"10.1109/jmems.2024.3447880","DOIUrl":"https://doi.org/10.1109/jmems.2024.3447880","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"59 1","pages":""},"PeriodicalIF":2.7,"publicationDate":"2024-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216962","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-27DOI: 10.1109/JMEMS.2024.3443641
Chengxin Li;Aojie Quan;Hemin Zhang;Chen Wang;Linlin Wang;Mustafa Mert Torunbalci;Yuan Wang;Michael Kraft
In this work, the relationship between nonlinear effects and the signal-to-noise ratio of a resonator is analyzed and the impact of reducing nonlinear effects of the resonator on the performance of a resonant accelerometer is investigated. A theoretical framework is formulated to evaluate the dynamic range of the double clamped-clamped resonator. A reduction of the mechanical nonlinearity is achieved through an external electrostatic force, resulting in an enhancement of the dynamic range from 93.8 dB to 132.6 dB. Experimental findings indicate the nonlinear coefficient is reduced to 2.2% compared to an approach without nonlinearity compensation. The nonlinearity compensation demonstrates a 12.8 dB improvement in the signal-to-noise ratio of the resonator, leading to a 5.5-fold increase in resolution of the accelerometer and an extension of the dynamic range by 15 dB. The proposed technique enables the performance of resonant sensors to be further optimized. [2024-0107]
{"title":"On Extending Signal-to-Noise Ratio of Resonators for a MEMS Resonant Accelerometers Using Nonlinearity Compensation","authors":"Chengxin Li;Aojie Quan;Hemin Zhang;Chen Wang;Linlin Wang;Mustafa Mert Torunbalci;Yuan Wang;Michael Kraft","doi":"10.1109/JMEMS.2024.3443641","DOIUrl":"10.1109/JMEMS.2024.3443641","url":null,"abstract":"In this work, the relationship between nonlinear effects and the signal-to-noise ratio of a resonator is analyzed and the impact of reducing nonlinear effects of the resonator on the performance of a resonant accelerometer is investigated. A theoretical framework is formulated to evaluate the dynamic range of the double clamped-clamped resonator. A reduction of the mechanical nonlinearity is achieved through an external electrostatic force, resulting in an enhancement of the dynamic range from 93.8 dB to 132.6 dB. Experimental findings indicate the nonlinear coefficient is reduced to 2.2% compared to an approach without nonlinearity compensation. The nonlinearity compensation demonstrates a 12.8 dB improvement in the signal-to-noise ratio of the resonator, leading to a 5.5-fold increase in resolution of the accelerometer and an extension of the dynamic range by 15 dB. The proposed technique enables the performance of resonant sensors to be further optimized. [2024-0107]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"568-576"},"PeriodicalIF":2.5,"publicationDate":"2024-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10651611","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
2D arrays are crucial for developing compact and efficient 3D ultrasound systems. Capacitive micromachined ultrasonic transducer (CMUT) arrays, providing convenient integration with supporting electronics, are advantageous for implementing such systems. Fabricating 2D CMUT arrays and integrated circuits (ICs) separately and then combining them in the packaging stage provides flexibility in design and integration. The integrated system can be used for beam-steering and electronic focusing in 3D space. Previously, fabrication processes were reported for implementing 2D CMUT arrays on glass substrates with copper through-glass-via (Cu-TGV) interconnects using anodic bonding and silicon through-glass-via (Si-TGV) interconnects using a sacrificial-release process. Both approaches had challenges, such as voids in Cu-vias, microcracks in laser-drilled glass, mechanical stress in CVD nitride layers, and low fill factor due to fabrication limitations. These challenges can be overcome by combining Si-TGV interconnects with an anodic bonding process. We developed a Si-TGV wafer with a backside glass layer to make it compatible with anodic bonding. We designed and fabricated $32times 32~2$ D CMUT arrays with a single cell per element to increase the fill factor and to produce high pressure. We measured an output pressure as high as 4.75 MPa $_{textbf {pp}}$ at 1.8 MHz by focusing the array at 8 mm (F $#1$ ). Four arrays, tiled next to each other in a $2times 2$ grid, focusing at 15 mm produced up to 8.65 MPa $_{textbf {pp}}$ pressure at 1.8 MHz. We achieved 99.9% element yield measured in a single array.[2024-0078]
{"title":"Fabrication of 32×32 2 D CMUT Arrays on a Borosilicate Glass Substrate With Silicon- Through-Wafer Interconnects Using Non- Aligned and Aligned Anodic Bonding","authors":"Muhammetgeldi Annayev;Ali Önder Biliroğlu;Erdem Şennik;Feysel Yalçın Yamaner;Ömer Oralkan","doi":"10.1109/JMEMS.2024.3440191","DOIUrl":"10.1109/JMEMS.2024.3440191","url":null,"abstract":"2D arrays are crucial for developing compact and efficient 3D ultrasound systems. Capacitive micromachined ultrasonic transducer (CMUT) arrays, providing convenient integration with supporting electronics, are advantageous for implementing such systems. Fabricating 2D CMUT arrays and integrated circuits (ICs) separately and then combining them in the packaging stage provides flexibility in design and integration. The integrated system can be used for beam-steering and electronic focusing in 3D space. Previously, fabrication processes were reported for implementing 2D CMUT arrays on glass substrates with copper through-glass-via (Cu-TGV) interconnects using anodic bonding and silicon through-glass-via (Si-TGV) interconnects using a sacrificial-release process. Both approaches had challenges, such as voids in Cu-vias, microcracks in laser-drilled glass, mechanical stress in CVD nitride layers, and low fill factor due to fabrication limitations. These challenges can be overcome by combining Si-TGV interconnects with an anodic bonding process. We developed a Si-TGV wafer with a backside glass layer to make it compatible with anodic bonding. We designed and fabricated \u0000<inline-formula> <tex-math>$32times 32~2$ </tex-math></inline-formula>\u0000D CMUT arrays with a single cell per element to increase the fill factor and to produce high pressure. We measured an output pressure as high as 4.75 MPa\u0000<inline-formula> <tex-math>$_{textbf {pp}}$ </tex-math></inline-formula>\u0000 at 1.8 MHz by focusing the array at 8 mm (F\u0000<inline-formula> <tex-math>$#1$ </tex-math></inline-formula>\u0000). Four arrays, tiled next to each other in a \u0000<inline-formula> <tex-math>$2times 2$ </tex-math></inline-formula>\u0000 grid, focusing at 15 mm produced up to 8.65 MPa\u0000<inline-formula> <tex-math>$_{textbf {pp}}$ </tex-math></inline-formula>\u0000 pressure at 1.8 MHz. We achieved 99.9% element yield measured in a single array.[2024-0078]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"586-595"},"PeriodicalIF":2.5,"publicationDate":"2024-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper reports the experimental estimation of the mechanical quality factor ( $Q_{m}$ ) of polymer films, which can be used as damping materials for MEMS. Considering the application to MEMS devices, polymer/PZT composite actuators using two thick photoresists (TMMR-NA1000 and SU8) and PDMS were fabricated and the Q factors were evaluated in a vacuum environment. The comparison between the measured and simulated Q factor confirmed a $Q_{m}$ range of 14-18 for TMMR-NA1000, 13-20 for SU8, and 5-8 for PDMS, indicating the superior damping capability of PDMS. Additionally, it was also found that the PZT thin film used in this study exhibited $Q_{m}$ of 200-220 under the driving voltage of 2 Vpp with +1V DC offset. The evaluation approach developed for assessing $Q_{m}$ of polymer materials is straightforward, easily implementable, and has broad structure applicability, offering a promising tool for assessing a wide array of materials. [2024-0096]
{"title":"Mechanical Quality Factor Evaluation of Damping Film Materials for Polymer/PZT Composite MEMS Actuator","authors":"Xuchen Wang;Yukio Suzuki;Chung-Min Li;Shuji Tanaka","doi":"10.1109/JMEMS.2024.3436865","DOIUrl":"10.1109/JMEMS.2024.3436865","url":null,"abstract":"This paper reports the experimental estimation of the mechanical quality factor (\u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000) of polymer films, which can be used as damping materials for MEMS. Considering the application to MEMS devices, polymer/PZT composite actuators using two thick photoresists (TMMR-NA1000 and SU8) and PDMS were fabricated and the Q factors were evaluated in a vacuum environment. The comparison between the measured and simulated Q factor confirmed a \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 range of 14-18 for TMMR-NA1000, 13-20 for SU8, and 5-8 for PDMS, indicating the superior damping capability of PDMS. Additionally, it was also found that the PZT thin film used in this study exhibited \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 of 200-220 under the driving voltage of 2 Vpp with +1V DC offset. The evaluation approach developed for assessing \u0000<inline-formula> <tex-math>$Q_{m}$ </tex-math></inline-formula>\u0000 of polymer materials is straightforward, easily implementable, and has broad structure applicability, offering a promising tool for assessing a wide array of materials. [2024-0096]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 5","pages":"631-639"},"PeriodicalIF":2.5,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142216965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-08-01DOI: 10.1109/JMEMS.2024.3422749
{"title":"TechRxiv: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/JMEMS.2024.3422749","DOIUrl":"10.1109/JMEMS.2024.3422749","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 4","pages":"503-503"},"PeriodicalIF":2.5,"publicationDate":"2024-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10619996","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141884816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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